Proceedings of First International Conference on Electronic Materials
Author : Takuo Sugano
Publisher :
Page : 280 pages
File Size : 38,79 MB
Release : 1989
Category : Technology & Engineering
ISBN :
Author : Takuo Sugano
Publisher :
Page : 280 pages
File Size : 38,79 MB
Release : 1989
Category : Technology & Engineering
ISBN :
Author : Bekkay Hajji
Publisher : Springer
Page : 786 pages
File Size : 28,86 MB
Release : 2018-08-01
Category : Technology & Engineering
ISBN : 9811314055
The proceedings present a selection of refereed papers presented at the 1st International Conference on Electronic Engineering and Renewable Energy (ICEERE 2018) held during 15-17 April 2018, Saidi, Morocco. The contributions from electrical engineers and experts highlight key issues and developments essential to the multifaceted field of electrical engineering systems and seek to address multidisciplinary challenges in Information and Communication Technologies. The book has a special focus on energy challenges for developing the Euro-Mediterranean regions through new renewable energy technologies in the agricultural and rural areas. The book is intended for academia, including graduate students, experienced researchers and industrial practitioners working in the fields of Electronic Engineering and Renewable Energy.
Author :
Publisher :
Page : 356 pages
File Size : 38,38 MB
Release : 1980
Category : Electronics
ISBN :
Author :
Publisher :
Page : 706 pages
File Size : 38,93 MB
Release : 1988
Category : Aeronautics
ISBN :
Author : British Library. Document Supply Centre
Publisher :
Page : 870 pages
File Size : 20,71 MB
Release : 2003
Category : Conference proceedings
ISBN :
Author :
Publisher : ASM International
Page : 1234 pages
File Size : 25,7 MB
Release : 1989-11-01
Category : Technology & Engineering
ISBN : 9780871702852
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author :
Publisher :
Page : 2232 pages
File Size : 36,43 MB
Release : 1990
Category : American literature
ISBN :
A world list of books in the English language.
Author : Roberto Fornari
Publisher : Woodhead Publishing
Page : 596 pages
File Size : 43,6 MB
Release : 2018-09-18
Category : Technology & Engineering
ISBN : 008102097X
Single Crystals of Electronic Materials: Growth and Properties is a complete overview of the state-of-the-art growth of bulk semiconductors. It is not only a valuable update on the body of information on crystal growth of well-established electronic materials, such as silicon, III-V, II-VI and IV-VI semiconductors, but also includes chapters on novel semiconductors, such as wide bandgap oxides like ZnO, Ga2, O3, In2, O3, Al2, O3, nitrides (AIN and GaN), and diamond. Each chapter focuses on a specific material, providing a comprehensive overview that includes applications and requirements, thermodynamic properties, schematics of growth methods, and more. - Presents the latest research and most comprehensive overview of both standard and novel semiconductors - Provides a systematic examination of important electronic materials, including their applications, growth methods, properties, technologies and defect and doping issues - Takes a close look at emerging materials, including wide bandgap oxides, nitrides and diamond
Author : David Michael Rowe
Publisher : CRC Press
Page : 555 pages
File Size : 34,10 MB
Release : 2012-04-25
Category : Technology & Engineering
ISBN : 1439874700
This book includes updated theoretical considerations which provide an insight into avenues of research most likely to result in further improvements in material performance. It details the latest techniques for the preparation of thermoelectric materials employed in energy harvesting, together with advances in the thermoelectric characterisation of nanoscale material. The book reviews the use of neutron beams to investigate phonons, whose behaviour govern the lattice thermal conductivity and includes a chapter on patents.
Author : Scott A. Schroeder
Publisher : ASTM International
Page : 154 pages
File Size : 29,79 MB
Release : 1994
Category : Electronics
ISBN : 0803119941
Unlike earlier electronic circuits, today's microelectronic devices demand that solder serve structural as well as electrical ends, and do so at relatively high temperature for years. Fatigue and failure of the solder has therefore become an issue in the industry. Nine studies from a May 1993 sympos