Author :
Publisher :
Page : 332 pages
File Size : 47,58 MB
Release : 2001
Category : Electronic apparatus and appliances
ISBN :
Author : Sanka Ganesan
Publisher : John Wiley & Sons
Page : 796 pages
File Size : 30,16 MB
Release : 2006-03-31
Category : Technology & Engineering
ISBN : 0470007796
Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.
Author : British Library. Document Supply Centre
Publisher :
Page : 870 pages
File Size : 49,15 MB
Release : 2001
Category : Conference proceedings
ISBN :
Author : Prasanta Kumar Dey
Publisher : Taylor & Francis
Page : 293 pages
File Size : 23,63 MB
Release : 2022-09-29
Category : Business & Economics
ISBN : 1000647234
This book examines the sustainability of supply chains in small and medium sized enterprises (SMEs), in developed and emerging economies. Drawing on contributions from experts in the field and examining case studies from a range of countries, including Thailand, Bangladesh, France, Spain, Austria and Greece, this book provides researchers and industry practitioners with guidance on how to make SMEs more sustainable through appropriate trade-offs between economic, environmental and social aspects. Over the course of the book, the authors examine the current state of sustainable supply chain practices, highlight the key issues and challenges, and identify critical success factors across different industries and geographical locations. They also explore how supply chain carbon footprints and effectiveness are measured, and navigate the delicate balance between reducing the carbon footprint whilst still ensuring enhanced productivity. Finally, the book reflects on how the circular economy model might facilitate higher sustainability of SMEs. Supply Chain Sustainability in Small and Medium Sized Enterprises will be of great interest to scholars and practitioners of supply chain management and sustainable business.
Author :
Publisher :
Page : pages
File Size : 39,87 MB
Release :
Category :
ISBN :
Author : Julian M. Allwood
Publisher :
Page : 80 pages
File Size : 20,90 MB
Release : 2006
Category :
ISBN : 9781902546520
Researchers have laid out a set of proposals outlining how consumers could satisfy their needs for clothes and textiles with significantly reduced impact on the environment, while also offering new business opportunities to UK companies. This book looks at these proposals.
Author : Philip Micklin
Publisher : Springer Science & Business Media
Page : 454 pages
File Size : 28,24 MB
Release : 2013-11-22
Category : Technology & Engineering
ISBN : 3642023568
The book is structured into six core parts. The first part sets the scene and explains how the use of Aral basin water resources, primarily used for irrigation, have destroyed the Aral Sea. The team explains how spheres and events interact and the related problems. Part 2 examines the social consequences of the ecological catastrophe and the affect of the Aral Sea desiccation on cultural and economic conditions of near Aral region. Part 3 explores the scientific causes of the destruction using detailed analyses and data plus some of their own research spanning aquatic biology, terrestrial biology, hydrology, water management and biodiversity. They also share some of the latest archaeological discoveries and paleobotanical analysis to delineate past levels and characteristics of the Aral Sea. There is particular focus on modern remote sensing and GIS techniques and how they can monitor the Aral Sea and the environment. Part 4 discusses regional and international initiatives to mitigate human and ecological problems of the Aral Sea and the wider political and economic consequences. With thorough insight of the total environment cost, the final chapters of the book will provide lessons for the future. There are insightful case studies throughout. Multidisciplinary by nature, all titles in our new reference book series will explore significant changes within the Earth’s ecosystems and to some extent, and will tackle ways to think about our changing environment.
Author : Surendra M. Gupta
Publisher : CRC Press
Page : 560 pages
File Size : 20,35 MB
Release : 2007-12-19
Category : Business & Economics
ISBN : 1420018795
Hotter temperatures, less arctic ice, loss of habitat-every other day, it seems, global warming and environmental issues make headlines. Consumer-driven environmental awareness combined with stricter recycling regulations have put the pressure on companies to produce and dispose of products in an environmentally responsible manner. Redefining indus
Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Page : 344 pages
File Size : 40,77 MB
Release : 1995
Category : Technology & Engineering
ISBN :
Author : Karl J. Puttlitz
Publisher : Springer Science & Business Media
Page : 1250 pages
File Size : 31,86 MB
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 1461513898
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
