Author : Electrochemical Society. Dielectric Science and Technology Division
Publisher :
Page : 290 pages
File Size : 41,39 MB
Release : 1999
Category : Science
ISBN :
Author : Panayotis C. Andricacos
Publisher : The Electrochemical Society
Page : 418 pages
File Size : 47,92 MB
Release : 1999
Category : Science
ISBN : 9781566772310
Author : Panayotis C. Andricacos
Publisher : The Electrochemical Society
Page : 262 pages
File Size : 40,31 MB
Release : 2002
Category : Computers
ISBN : 9781566772730
"Held May 2000 in Toronto, Canada, as part of the 197th meeting of the Electrochemical Society."--Pref.
Author : Kazuo Kondo
Publisher : The Electrochemical Society
Page : 422 pages
File Size : 33,36 MB
Release : 2005
Category : Copper plating
ISBN :
Papers in this volume are from the 199th ECS Meeting, held in Washington, DC, Spring 2001. Morphology evolution encompasses electrochemical processing in ULSI fabrication, shape evolution, growth habit, and microstructure of electrodeposits. The most prominent example at present is the electrochemical deposition of copper for ULSI interconnects. Many other electrochemical processes at various stages of emergence and development hold promise for the electronics industry and beyond.
Author : Electrochemical Society. Meeting
Publisher : The Electrochemical Society
Page : 620 pages
File Size : 26,51 MB
Release : 2003
Category : Technology & Engineering
ISBN : 9781566773768
Author : Cor L. Claeys
Publisher : The Electrochemical Society
Page : 636 pages
File Size : 50,25 MB
Release : 2001
Category : Technology & Engineering
ISBN : 9781566773089
Author : G. S. Mathad
Publisher : The Electrochemical Society
Page : 358 pages
File Size : 50,42 MB
Release : 2000
Category : Science
ISBN : 9781566772549
Author :
Publisher :
Page : 0 pages
File Size : 20,77 MB
Release : 1999
Category :
ISBN : 9781566772310
Author : John O. Dukovic
Publisher : The Electrochemical Society
Page : 288 pages
File Size : 12,16 MB
Release : 2007-09
Category : Science
ISBN : 1566775868
The papers in this issue describe the latest advances in fundamental and practical aspects of electrochemical processes for fabrication of microelectronic devices and related structures. Topics range from plating to etching, chips to packages, mechanisms to models, through-silicon vias to nanotubes, tin to ruthenium, capping to cooling, porous gold to porous alumina, probe-card springs to solder balls, electroless deposition to CMP, TFT-LCDs to magnetic nanowires and beyond.
Author : Milan Paunovic
Publisher : The Electrochemical Society
Page : 666 pages
File Size : 31,63 MB
Release : 1998
Category : Science
ISBN : 9781566771801
