Book Description
"Electronics, Dielectric Science and Technology, and High Temperature Materials Divisions."
Author : Dim-Lee Kwong
Publisher : The Electrochemical Society
Page : 458 pages
File Size : 48,52 MB
Release : 2001
Category : Technology & Engineering
ISBN : 9781566773157
"Electronics, Dielectric Science and Technology, and High Temperature Materials Divisions."
Author : Fred Roozeboom
Publisher : The Electrochemical Society
Page : 482 pages
File Size : 43,2 MB
Release : 2000
Category : Technology & Engineering
ISBN : 9781566772747
The proceedings from this May 2000 symposium illustrate the range of applications in Rapid Thermal Processing (RTP). The refereed papers cover a variety of issues, such as ultra-shallow junctions; contacts for nanoscale CMOS; gate stacks; new applications of RTP, such as for the enhanced crystalization of amorphous silicon thin films; and advances on RTP systems and process monitoring, including optimizing and controlling gas flows in an RTCVD reactor. Most presentations are supported by charts and other graphical data. c. Book News Inc.
Author : Paul J. Timans
Publisher : The Electrochemical Society
Page : 500 pages
File Size : 11,77 MB
Release : 2002
Category : Technology & Engineering
ISBN : 9781566773348
Author : Mehmet C. Öztürk
Publisher : The Electrochemical Society
Page : 444 pages
File Size : 16,92 MB
Release : 2004
Category : Technology & Engineering
ISBN : 9781566774062
Author : Yoshio Nishi
Publisher : CRC Press
Page : 1720 pages
File Size : 23,15 MB
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 1420017667
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author : Bernd Schmidt
Publisher : Springer Science & Business Media
Page : 425 pages
File Size : 29,29 MB
Release : 2012-12-13
Category : Technology & Engineering
ISBN : 3211993568
A comprehensive review of ion beam application in modern materials research is provided, including the basics of ion beam physics and technology. The physics of ion-solid interactions for ion implantation, ion beam synthesis, sputtering and nano-patterning is treated in detail. Its applications in materials research, development and analysis, developments of special techniques and interaction mechanisms of ion beams with solid state matter result in the optimization of new material properties, which are discussed thoroughly. Solid-state properties optimization for functional materials such as doped semiconductors and metal layers for nano-electronics, metal alloys, and nano-patterned surfaces is demonstrated. The ion beam is an important tool for both materials processing and analysis. Researchers engaged in solid-state physics and materials research, engineers and technologists in the field of modern functional materials will welcome this text.
Author : H. Fukuda
Publisher : Elsevier
Page : 161 pages
File Size : 14,6 MB
Release : 2003-04-02
Category : Science
ISBN : 0080540260
This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices.This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.
Author : Cor L. Claeys
Publisher : The Electrochemical Society
Page : 636 pages
File Size : 36,41 MB
Release : 2001
Category : Technology & Engineering
ISBN : 9781566773089
Author : Richard B. Fair
Publisher : Academic Press
Page : 441 pages
File Size : 19,74 MB
Release : 2012-12-02
Category : Technology & Engineering
ISBN : 0323139809
This is the first definitive book on rapid thermal processing (RTP), an essential namufacturing technology for single-wafer processing in highly controlled environments. Written and edited by nine experts in the field, this book covers a range of topics for academics and engineers alike, moving from basic theory to advanced technology for wafer manufacturing. The book also provides new information on the suitability or RTP for thin film deposition, junction formation, silicides, epitaxy, and in situ processing. Complete discussions on equipment designs and comparisons between RTP and other processing approaches also make this book useful for supplemental information on silicon processing, VLSI processing, and integrated circuit engineering.
Author : B. J. Pawlak
Publisher :
Page : 240 pages
File Size : 43,16 MB
Release : 2006-10-11
Category : Science
ISBN :
This volume from the 2006 MRS Spring Meeting focuses on fundamental materials science and device research for current transistor technologies. Materials scientists come together with silicon technologists and TCAD researchers and activation technologies for integrated circuits, to discuss current achievements research directions.