Reflow Soldering Process Development for the Electronics Industry
Author : Dawn M. Robinson
Publisher :
Page : 82 pages
File Size : 12,54 MB
Release : 1997
Category :
ISBN :
Reflow Soldering Processes
Author : Ning-Cheng Lee
Publisher : Newnes
Page : 282 pages
File Size : 24,40 MB
Release : 2002-01-11
Category : Technology & Engineering
ISBN : 0750672188
Book Description
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Reflow Soldering
Author : Balázs Illés
Publisher : Elsevier
Page : 295 pages
File Size : 23,71 MB
Release : 2020-07-02
Category : Technology & Engineering
ISBN : 0128185066
Book Description
Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles Analyses and compares the different reflow ovens Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality Introduces Vapor Phase Soldering (VPS) technology
Solder Joint Reliability
Author : John H. Lau
Publisher : Springer Science & Business Media
Page : 649 pages
File Size : 43,14 MB
Release : 2013-11-27
Category : Technology & Engineering
ISBN : 1461539102
Book Description
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Lead-Free Soldering in Electronics
Author : Katsuaki Suganuma
Publisher : CRC Press
Page : 355 pages
File Size : 31,84 MB
Release : 2003-12-11
Category : Technology & Engineering
ISBN : 0824758595
Book Description
Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and design Mechanical evaluation in electronics Lead-free solder paste and reflow soldering Wave soldering Plating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.
Soldering Handbook For Printed Circuits and Surface Mounting
Author : Howard H. Manko
Publisher : Springer Science & Business Media
Page : 548 pages
File Size : 15,76 MB
Release : 1995-10-31
Category : Computers
ISBN : 9780442012069
Book Description
Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.
Lead-free Soldering Process Development and Reliability
Author : Jasbir Bath
Publisher : John Wiley & Sons
Page : 512 pages
File Size : 39,11 MB
Release : 2020-07-28
Category : Technology & Engineering
ISBN : 1119482038
Book Description
Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
Manufacturing Technology in the Electronics Industry
Author : P. Edwards
Publisher : Springer Science & Business Media
Page : 296 pages
File Size : 36,64 MB
Release : 2012-12-06
Category : Science
ISBN : 9401131309
Book Description
The sequence of events which led to the writing of this book started at a seminar on Manufacturing Technology in the Electronics Industry given by the Institution of Production Engineers in 1987. The seminar identified that the field of manufacturing engineering for the electronics industry was effectively missing from the vast majority of production engineering degree courses. The reason for this was that production engineering departments typically spring from mechanical engineering departments. This leads to a mechanical bias in the practical aspects of such courses. The consequence of this was that electronics companies could not recruit graduates with both relevant production engineering and electronic engineering backgrounds. This necessitated either recruiting production engineering graduates and giving them the necessary electronic engineering training, or giving production engineering training to electronic engineering graduates. A consequence of the lack of courses in a subject is that there is also a lack of relevant textbooks in the area, as most textbooks are intended to tie into courses. In the field of manufacturing technology for the electronics industry, existing textbooks tend to be highly specialized and mainly concerned with the fabrication of semiconductor devices.
Lead-Free Solder Process Development
Author : Gregory Henshall
Publisher : John Wiley & Sons
Page : 241 pages
File Size : 30,95 MB
Release : 2011-03-29
Category : Technology & Engineering
ISBN : 1118102746
Book Description
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
Reflow Soldering Processes
Author : Ning-Cheng Lee
Publisher : Elsevier
Page : 288 pages
File Size : 10,17 MB
Release : 2002-01-24
Category : Technology & Engineering
ISBN : 008049224X
Book Description
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
