Development of Adhesives with Improved Heat Resistance in Bonds of Stainless Steel


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Adhesives containing combinations of polyamide resin with melamine compounds, epoxy resins with vinyl anhydride copolymers, and inorganic fillers were studied as heat-resistant bonding agents for stainless steel. Attempts to improve the strength of the polyamide-melamine type adhesive at 550° F. were unsuccessful. Studies were made of the heat-resistant properties of eight different epoxy resins modified with an ethyl acrylate-maleic anhydride copolymer and with maleic anhydride. The most promising of these were adhesive formulations of epoxy resins which were glycidyl ethers of either bisphenol A or tetra hydroxy phenyl ethane and contained aluminum powder and arsenic pentoxide fillers impregnated into asbestos cloth. (Author).




NASA Technical Note


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Report


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Research Program


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Index of NACA Technical Publications


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