Rubber-band Based Topological Router
Author : Tal Dayan
Publisher :
Page : 326 pages
File Size : 39,62 MB
Release : 1997
Category : Computer algorithms
ISBN :
Author : Tal Dayan
Publisher :
Page : 326 pages
File Size : 39,62 MB
Release : 1997
Category : Computer algorithms
ISBN :
Author : Naveed A. Sherwani
Publisher : John Wiley & Sons
Page : 386 pages
File Size : 19,39 MB
Release : 1995-03
Category : Education
ISBN : 9780780310896
This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.
Author : Jeffrey Z. Su
Publisher :
Page : 308 pages
File Size : 14,72 MB
Release : 1998
Category : Computer-aided design
ISBN :
Author : Man-Fai Yu
Publisher :
Page : 314 pages
File Size : 11,84 MB
Release : 1997
Category : Computer algorithms
ISBN :
Author : Naveed A. Sherwani
Publisher : Springer Science & Business Media
Page : 554 pages
File Size : 36,91 MB
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 1461523516
Algorithms for VLSI Physical Design Automation, Second Edition is a core reference text for graduate students and CAD professionals. Based on the very successful First Edition, it provides a comprehensive treatment of the principles and algorithms of VLSI physical design, presenting the concepts and algorithms in an intuitive manner. Each chapter contains 3-4 algorithms that are discussed in detail. Additional algorithms are presented in a somewhat shorter format. References to advanced algorithms are presented at the end of each chapter. Algorithms for VLSI Physical Design Automation covers all aspects of physical design. In 1992, when the First Edition was published, the largest available microprocessor had one million transistors and was fabricated using three metal layers. Now we process with six metal layers, fabricating 15 million transistors on a chip. Designs are moving to the 500-700 MHz frequency goal. These stunning developments have significantly altered the VLSI field: over-the-cell routing and early floorplanning have come to occupy a central place in the physical design flow. This Second Edition introduces a realistic picture to the reader, exposing the concerns facing the VLSI industry, while maintaining the theoretical flavor of the First Edition. New material has been added to all chapters, new sections have been added to most chapters, and a few chapters have been completely rewritten. The textual material is supplemented and clarified by many helpful figures. Audience: An invaluable reference for professionals in layout, design automation and physical design.
Author : Raymond Kong
Publisher :
Page : 122 pages
File Size : 33,68 MB
Release : 1992
Category : Electronic digital computers
ISBN :
Author : Jun Dong Cho
Publisher : World Scientific
Page : 266 pages
File Size : 23,16 MB
Release : 1996-06-12
Category : Technology & Engineering
ISBN : 9814500267
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
Author :
Publisher : Universal-Publishers
Page : 625 pages
File Size : 41,33 MB
Release :
Category :
ISBN : 161233623X
Author : Ernest S. Kuh
Publisher : World Scientific
Page : 172 pages
File Size : 50,35 MB
Release : 1992
Category : Technology & Engineering
ISBN : 9789810209254
Multichip Module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints. Written by outstanding experts in their fields, this volume should be considered essential reading.
Author : Raminderpal Singh
Publisher : John Wiley & Sons
Page : 484 pages
File Size : 26,17 MB
Release : 2001-12-12
Category : Technology & Engineering
ISBN : 0471150428
"...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." —Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. Covers signal integrity effects in high performance Radio Frequency (RF) IC Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future A Wiley-IEEE Press publication