Semi-therm 6
Author : IEEE Components, Hybrids, and Manufacturing Technology Society
Publisher :
Page : pages
File Size : 42,54 MB
Release : 1990
Category :
ISBN :
Author : IEEE Components, Hybrids, and Manufacturing Technology Society
Publisher :
Page : pages
File Size : 42,54 MB
Release : 1990
Category :
ISBN :
Author :
Publisher :
Page : 206 pages
File Size : 35,53 MB
Release : 1995
Category : Amorphous semiconductors
ISBN :
Author :
Publisher :
Page : 282 pages
File Size : 20,52 MB
Release : 2001
Category : Amorphous semiconductors
ISBN :
Author : Michael Pecht
Publisher : CRC Press
Page : 904 pages
File Size : 37,70 MB
Release : 2018-10-24
Category : Technology & Engineering
ISBN : 1351838415
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Author : E. Beyne
Publisher : Springer Science & Business Media
Page : 358 pages
File Size : 22,81 MB
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9401155062
For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.
Author : Institute of Electrical and Electronics Engineers
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Page : 312 pages
File Size : 15,46 MB
Release : 1997
Category : Technology & Engineering
ISBN :
This volume features coverage of new developments in and applications relating to generation and removal of heat within semiconductor devices, and measurement of junction temperatures under various application and environmental conditions.
Author : Márta Rencz
Publisher : MDPI
Page : 310 pages
File Size : 14,40 MB
Release : 2021-01-12
Category : Technology & Engineering
ISBN : 303943831X
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Author : Alhussein Albarbar
Publisher : Springer
Page : 224 pages
File Size : 45,91 MB
Release : 2017-07-19
Category : Technology & Engineering
ISBN : 3319598287
This book analyzes the thermal characteristics of power electronic devices (PEDs) with a focus on those used in wind and solar energy systems. The authors focus on the devices used in such applications, for example boost converters and inverters under different operating conditions. The book explains in detail finite element modeling techniques, setting up measuring systems, data analysis, and PEDs’ lifetime calculations. It is appropriate reading for graduate students and researchers who focus on the design and reliability of power electronic devices.
Author : Daniela S. Gaal
Publisher : DEStech Publications, Inc
Page : 1018 pages
File Size : 33,65 MB
Release : 2010
Category : Technology & Engineering
ISBN : 1605950157
Author : C.J. Hoogendoorn
Publisher : Springer Science & Business Media
Page : 334 pages
File Size : 29,62 MB
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9401110824
The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.