SEMI-THERM XVII
Author : Semiconductor Thermal Measurement and Management Symposium
Publisher :
Page : 188 pages
File Size : 25,67 MB
Release : 2002
Category :
ISBN :
Author : Semiconductor Thermal Measurement and Management Symposium
Publisher :
Page : 188 pages
File Size : 25,67 MB
Release : 2002
Category :
ISBN :
Author :
Publisher :
Page : 48 pages
File Size : 47,81 MB
Release : 2002
Category :
ISBN :
Author : Paul Wesling
Publisher :
Page : pages
File Size : 29,45 MB
Release : 2017
Category :
ISBN : 9781538615317
Author :
Publisher :
Page : pages
File Size : 35,2 MB
Release : 2016
Category : Semiconductors
ISBN : 9781509023363
Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Page : 260 pages
File Size : 10,97 MB
Release : 2001
Category : Technology & Engineering
ISBN : 9780780366497
"International forum for the presentation of new developments in and applications relating to generation and removal of heat within semiconductor devices, and measurement of junction temperatures under various application and environmental conditions."--Page [i].
Author :
Publisher :
Page : 392 pages
File Size : 37,23 MB
Release : 2005
Category : Amorphous semiconductors
ISBN :
Author : Marta Rencz
Publisher : Springer Nature
Page : 389 pages
File Size : 48,22 MB
Release : 2023-01-23
Category : Technology & Engineering
ISBN : 3030861740
This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
Author :
Publisher :
Page : 186 pages
File Size : 11,3 MB
Release : 2002
Category : Electronic packaging
ISBN :
Author : Kazuo Kondo
Publisher : Springer
Page : 423 pages
File Size : 23,34 MB
Release : 2015-12-09
Category : Science
ISBN : 3319186752
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
Author :
Publisher :
Page : 1150 pages
File Size : 27,61 MB
Release : 2002
Category : Electronic apparatus and appliances
ISBN :