Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 13-15, 1997, Austin, TX, USA


Book Description

The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.










Index of Conference Proceedings


Book Description







Electronic Design


Book Description