Scientific and Technical Aerospace Reports
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Publisher :
Page : 1572 pages
File Size : 21,83 MB
Release : 1992
Category : Aeronautics
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Author :
Publisher :
Page : 1572 pages
File Size : 21,83 MB
Release : 1992
Category : Aeronautics
ISBN :
Author : Wade H. Shafer
Publisher : Springer Science & Business Media
Page : 430 pages
File Size : 22,25 MB
Release : 2012-12-06
Category : Science
ISBN : 1461573947
Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Oata Analysis and Synthesis (CINOAS) * at Purdue. University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all con cerned if the printing and distribution of the volumes were handled by an interna tional publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Cor poration of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 33 (thesis year 1988) a total of 13,273 theses titles from 23 Canadian and 1 85 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this important annual reference work. While Volume 33 reports theses submitted in 1988, on occasion, certain univer sities do report theses submitted in previous years but not reported at the time.
Author : Sadik Kakaç
Publisher : Springer Science & Business Media
Page : 953 pages
File Size : 38,91 MB
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9401110905
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Author :
Publisher :
Page : 616 pages
File Size : 13,35 MB
Release : 1988-06
Category : Science
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Author :
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Page : 384 pages
File Size : 32,96 MB
Release : 1988
Category : Mechanics, Applied
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Page : 674 pages
File Size : 22,34 MB
Release : 1993
Category : Electronic packaging
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Page : 1428 pages
File Size : 13,88 MB
Release : 1988
Category : Government reports announcements & index
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Author : M.D. Kelleher
Publisher : Elsevier
Page : 1002 pages
File Size : 13,65 MB
Release : 2012-12-02
Category : Technology & Engineering
ISBN : 044459860X
The papers contained in this volume reflect the ingenuity and originality of experimental work in the areas of fluid mechanics, heat transfer and thermodynamics. The contributors are drawn from 27 countries which indicates how well the worldwide scientific community is networked. The papers cover a broad spectrum from the experimental investigation of complex fundamental physical phenomena to the study of practical devices and applications. A uniform outline and method of presentation has been used for each paper.
Author :
Publisher :
Page : 176 pages
File Size : 24,79 MB
Release : 2004
Category : Electronic packaging
ISBN :
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Publisher :
Page : 324 pages
File Size : 19,65 MB
Release : 1999
Category : Amorphous semiconductors
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