Special Issue on Adhesion Aspects in Microelectromechanical Systems (MEMS)
Author : L. Paivikki Buchwalter
Publisher :
Page : 192 pages
File Size : 46,19 MB
Release : 2003
Category : Adhesion
ISBN :
Adhesion Aspects in MEMS/NEMS
Author : Seong H. Kim
Publisher : CRC Press
Page : 424 pages
File Size : 31,16 MB
Release : 2011-02-18
Category : Science
ISBN : 9004190953
Book Description
Phenomena associated with the adhesion interaction of surfaces have been a critical aspect of micro- and nanosystem development and performance since the first MicroElectroMechanicalSystems(MEMS) were fabricated. These phenomena are ubiquitous in nature and are present in all systems, however MEMS devices are particularly sensitive to their effects
Special Issue on Fundamental Aspects of Adhesion
Author : John E. E. Baglin
Publisher :
Page : 119 pages
File Size : 46,84 MB
Release : 1994
Category :
ISBN :
Book Description
Adhesion Aspects in MEMS/NEMS
Author : Seong H. Kim
Publisher : CRC Press
Page : 424 pages
File Size : 38,41 MB
Release : 2011-02-18
Category : Science
ISBN : 9004190945
Book Description
Phenomena associated with the adhesion interaction of surfaces have been a critical aspect of micro- and nanosystem development and performance since the first MicroElectroMechanicalSystems(MEMS) were fabricated. These phenomena are ubiquitous in nature and are present in all systems, however MEMS devices are particularly sensitive to their effects owing to their small size and limited actuation force that can be generated. Extension of MEMS technology concepts to the nanoscale and development of NanoElectroMechanicalSystems(NEMS) will result in systems even more strongly influenced by surface forces. The book is divided into five parts as follows: Part 1: Understanding Through Continuum Theory; Part 2: Computer Simulation of Interfaces; Part 3: Adhesion and Friction Measurements; Part 4: Adhesion in Practical Applications; and Part 5: Adhesion Mitigation Strategies. This compilation constitutes the first book on this extremely important topic in the burgeoning field of MEMS/NEMS. It is obvious from the topics covered in this book that bountiful information is contained here covering understanding of surface forces and adhesion as well as novel ways to mitigate adhesion in MEMS/NEMS. This book should be of great interest to anyone engaged in the wonderful and fascinating field of MEMS/NEMS, as it captures the current R&D activity.
Mems Packaging
Author : Yung-cheng Lee
Publisher : World Scientific
Page : 363 pages
File Size : 44,65 MB
Release : 2018-01-03
Category : Technology & Engineering
ISBN : 9813229373
Book Description
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Mems for Biomedical Applications
Author : Shekhar Bhansali
Publisher : Elsevier
Page : 511 pages
File Size : 13,45 MB
Release : 2012-07-18
Category : Technology & Engineering
ISBN : 0857096273
Book Description
The application of Micro Electro Mechanical Systems (MEMS) in the biomedical field is leading to a new generation of medical devices. MEMS for biomedical applications reviews the wealth of recent research on fabrication technologies and applications of this exciting technology.The book is divided into four parts: Part one introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms. Part two describes applications of MEMS for biomedical sensing and diagnostic applications. MEMS for in vivo sensing and electrical impedance spectroscopy are investigated, along with ultrasonic transducers, and lab-on-chip devices. MEMS for tissue engineering and clinical applications are the focus of part three, which considers cell culture and tissue scaffolding devices, BioMEMS for drug delivery and minimally invasive medical procedures. Finally, part four reviews emerging biomedical applications of MEMS, from implantable neuroprobes and ocular implants to cellular microinjection and hybrid MEMS.With its distinguished editors and international team of expert contributors, MEMS for biomedical applications provides an authoritative review for scientists and manufacturers involved in the design and development of medical devices as well as clinicians using this important technology. Reviews the wealth of recent research on fabrication technologies and applications of Micro Electro Mechanical Systems (MEMS) in the biomedical field Introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms Considers MEMS for biomedical sensing and diagnostic applications, along with MEMS for in vivo sensing and electrical impedance spectroscopy
Special Issue on Gecko-inspired Adhesion
Author : Ronal S. Fearing
Publisher :
Page : 1117 pages
File Size : 42,85 MB
Release : 2007
Category : Adhesion
ISBN :
Book Description
MEMS Sensors and Resonators
Author : Frederic Nabki
Publisher : MDPI
Page : 164 pages
File Size : 15,95 MB
Release : 2020-05-27
Category : Technology & Engineering
ISBN : 3039288652
Book Description
Microelectromechanical systems (MEMS) have had a profound impact on a wide range of applications. The degree of miniaturization made possible by MEMS technology has significantly improved the functionalities of many systems, and the performance of MEMS has steadily improved as its uses augment. Notably, MEMS sensors have been prevalent in motion sensing applications for decades, and the sensing mechanisms leveraged by MEMS have been continuously extended to applications spanning the detection of gases, magnetic fields, electromagnetic radiation, and more. In parallel, MEMS resonators have become an emerging field of MEMS and affected subfields such as electronic timing and filtering, and energy harvesting. They have, in addition, enabled a wide range of resonant sensors. For many years now, MEMS have been the basis of various industrial successes, often building on novel academic research. Accordingly, this Special Issue explores many research innovations in MEMS sensors and resonators, from biomedical applications to energy harvesting, gas sensing, resonant sensing, and timing.
Nano-tribology and Materials in MEMS
Author : Sujeet K. Sinha
Publisher : Springer Science & Business Media
Page : 276 pages
File Size : 45,11 MB
Release : 2013-08-27
Category : Technology & Engineering
ISBN : 3642369359
Book Description
This book brings together recent developments in the areas of MEMS tribology, novel lubricants and coatings for nanotechnological applications, biomimetics in tribology and fundamentals of micro/nano-tribology. Tribology plays important roles in the functioning and durability of machines at small length scales because of the problems associated with strong surface adhesion, friction, wear etc. Recently, a number of studies have been conducted to understand tribological phenomena at nano/micro scales and many new tribological solutions for MEMS have been proposed.
Semiconductor Wafer Bonding
Author : H. Baumgart
Publisher : The Electrochemical Society
Page : 310 pages
File Size : 42,90 MB
Release : 2002
Category : Technology & Engineering
ISBN : 9781566773607
