Author : Yoseph Bar-Cohen
Publisher : CRC Press
Page : 518 pages
File Size : 10,34 MB
Release : 2016-08-19
Category : Science
ISBN : 149870039X
This book addresses the growing interest in low temperature technologies. Since the subject of low temperature materials and mechanisms is multidisciplinary, the chapters reflect the broadest possible perspective of the field. Leading experts in the specific subject area address the various related science and engineering chemistry, material science, electrical engineering, mechanical engineering, metallurgy, and physics.
Author : Reza Ghodssi
Publisher : Springer Science & Business Media
Page : 1211 pages
File Size : 25,12 MB
Release : 2011-03-18
Category : Technology & Engineering
ISBN : 0387473181
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
Author : A. R. Jha
Publisher : CRC Press
Page : 434 pages
File Size : 43,50 MB
Release : 2008-04-08
Category : Technology & Engineering
ISBN : 0849380707
The integration of microelectromechanical systems (MEMS) and nanotechnology (NT) in sensors and devices significantly reduces their weight, size, power consumption, and production costs. These sensors and devices can then play greater roles in defense operations, wireless communication, the diagnosis and treatment of disease, and many more applicat
Author : Markku Tilli
Publisher : Elsevier
Page : 1028 pages
File Size : 12,59 MB
Release : 2020-04-17
Category : Technology & Engineering
ISBN : 012817787X
Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. - Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits - Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures - Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements - Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors
Author :
Publisher :
Page : 84 pages
File Size : 33,36 MB
Release : 2016
Category : Technology
ISBN :
Author :
Publisher :
Page : 602 pages
File Size : 26,38 MB
Release : 1995
Category : Aeronautics
ISBN :
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Author : Masayoshi Esashi
Publisher : John Wiley & Sons
Page : 528 pages
File Size : 23,73 MB
Release : 2021-03-16
Category : Technology & Engineering
ISBN : 3527823255
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author : Alper Erturk
Publisher : John Wiley & Sons
Page : 377 pages
File Size : 42,50 MB
Release : 2011-04-04
Category : Technology & Engineering
ISBN : 1119991358
The transformation of vibrations into electric energy through the use of piezoelectric devices is an exciting and rapidly developing area of research with a widening range of applications constantly materialising. With Piezoelectric Energy Harvesting, world-leading researchers provide a timely and comprehensive coverage of the electromechanical modelling and applications of piezoelectric energy harvesters. They present principal modelling approaches, synthesizing fundamental material related to mechanical, aerospace, civil, electrical and materials engineering disciplines for vibration-based energy harvesting using piezoelectric transduction. Piezoelectric Energy Harvesting provides the first comprehensive treatment of distributed-parameter electromechanical modelling for piezoelectric energy harvesting with extensive case studies including experimental validations, and is the first book to address modelling of various forms of excitation in piezoelectric energy harvesting, ranging from airflow excitation to moving loads, thus ensuring its relevance to engineers in fields as disparate as aerospace engineering and civil engineering. Coverage includes: Analytical and approximate analytical distributed-parameter electromechanical models with illustrative theoretical case studies as well as extensive experimental validations Several problems of piezoelectric energy harvesting ranging from simple harmonic excitation to random vibrations Details of introducing and modelling piezoelectric coupling for various problems Modelling and exploiting nonlinear dynamics for performance enhancement, supported with experimental verifications Applications ranging from moving load excitation of slender bridges to airflow excitation of aeroelastic sections A review of standard nonlinear energy harvesting circuits with modelling aspects.
Author : Sergey Edward Lyshevski
Publisher : CRC Press
Page : 461 pages
File Size : 27,57 MB
Release : 2018-10-03
Category : Technology & Engineering
ISBN : 1420040510
The development of micro- and nano-mechanical systems (MEMS and NEMS) foreshadows momentous changes not only in the technological world, but in virtually every aspect of human life. The future of the field is bright with opportunities, but also riddled with challenges, ranging from further theoretical development through advances in fabrication technologies, to developing high-performance nano- and microscale systems, devices, and structures, including transducers, switches, logic gates, actuators and sensors. MEMS and NEMS: Systems, Devices, and Structures is designed to help you meet those challenges and solve fundamental, experimental, and applied problems. Written from a multi-disciplinary perspective, this book forms the basis for the synthesis, modeling, analysis, simulation, control, prototyping, and fabrication of MEMS and NEMS. The author brings together the various paradigms, methods, and technologies associated with MEMS and NEMS to show how to synthesize, analyze, design, and fabricate them. Focusing on the basics, he illustrates the development of NEMS and MEMS architectures, physical representations, structural synthesis, and optimization. The applications of MEMS and NEMS in areas such as biotechnology, medicine, avionics, transportation, and defense are virtually limitless. This book helps prepare you to take advantage of their inherent opportunities and effectively solve problems related to their configurations, systems integration, and control.
Author :
Publisher :
Page : 924 pages
File Size : 39,50 MB
Release : 2007
Category : Dissertations, Academic
ISBN :
