The Effect of Radiation on the Electrical Properties of Aluminum Gallium Nitride/Gallium Nitride Heterostructures


Book Description

AlGaN/GaN Heterojunction Field Effect Transistors (HFETs) were irradiated at low temperature and the temperature dependent changes to drain current, gate current, capacitance, and transconductance were measured. The results were compared to the charge control model of the drain current and trap-assisted tunneling model of the gate current to determine the source of the radiation-induced changes. AlGaN/GaN HFETs demonstrated threshold voltage shifts and drain current changes after irradiation. After electron and neutron irradiation applied at ~80 K, measurement of the drain current at this temperature showed an increase that saturated after 10^13 electrons/cm^2 or 10^10 neutrons/cm^2 due to positive charge build-up in the AlGaN layer. Measurement at room temperature after low-temperature irradiation showed a decrease in drain current due to the build up of charged defects along the AlGaN-GaN interface that decrease the mobility in the 2DEG and hence decrease the current. Gate leakage currents increased after low temperature irradiation and the increase was persistent after room temperature annealing. The increased leakage current was attributed to trap-assisted tunneling after application of the trap-assisted tunneling model. Comparison of the model to post-irradiation vs. pre-irradiation data showed that the dominant parameter change causing increased gate current was an increase in trap concentration.




GaN Transistors for Efficient Power Conversion


Book Description

An up-to-date, practical guide on upgrading from silicon to GaN, and how to use GaN transistors in power conversion systems design This updated, third edition of a popular book on GaN transistors for efficient power conversion has been substantially expanded to keep students and practicing power conversion engineers ahead of the learning curve in GaN technology advancements. Acknowledging that GaN transistors are not one-to-one replacements for the current MOSFET technology, this book serves as a practical guide for understanding basic GaN transistor construction, characteristics, and applications. Included are discussions on the fundamental physics of these power semiconductors, layout, and other circuit design considerations, as well as specific application examples demonstrating design techniques when employing GaN devices. GaN Transistors for Efficient Power Conversion, 3rd Edition brings key updates to the chapters of Driving GaN Transistors; Modeling, Simulation, and Measurement of GaN Transistors; DC-DC Power Conversion; Envelope Tracking; and Highly Resonant Wireless Energy Transfer. It also offers new chapters on Thermal Management, Multilevel Converters, and Lidar, and revises many others throughout. Written by leaders in the power semiconductor field and industry pioneers in GaN power transistor technology and applications Updated with 35% new material, including three new chapters on Thermal Management, Multilevel Converters, Wireless Power, and Lidar Features practical guidance on formulating specific circuit designs when constructing power conversion systems using GaN transistors A valuable resource for professional engineers, systems designers, and electrical engineering students who need to fully understand the state-of-the-art GaN Transistors for Efficient Power Conversion, 3rd Edition is an essential learning tool and reference guide that enables power conversion engineers to design energy-efficient, smaller, and more cost-effective products using GaN transistors.







Aluminum Gallium Nitride


Book Description

In the last decade, All-, GaXN/GaN High Electron Mobility Transistors (HEMTs) have been intensively studied because their intrinsic electrical properties make them attractive for high power microwave device applications. Despite much progress, current slump continues to be a problem, limiting output power, reducing reliability, and complicating device modelling. In this work, a complete AĨ-, G, ̃N/GÑ HEMT fabrication procedure was developed, and electrical characteristics related to current slump, microwave modelling, and delay time analysis were explored. Low resistance ohmic contacts were achieved, enabling high channel current densities. Schottky contacts were developed with a new ion implant isolation architecture, enabling gate leakage currents 2 to 4 orders of magnitude lower than typical results from the literature. Through pulsed current-voltage measurements, the importance of bias stresses in the gate-source region was demonstrated for the first time. In contrast to the conventional "virtual gate" model, gate-source stresses were shown to be more important than gatedrain stresses when biased near threshold. Slow slump transients were studied by passivating transistor surfaces with ultrathin layers. These results excluded dielectric strain and electron injection reduction as viable passivation mechanisms. A novel model was proposed associating slow slump behaviour with trapping of many electrons at screw dislocation sites. The effect of slump on RF properties was examined through microwave measurements by extracting the parasitic source and drain resistances without special biasing. Besides significantly improving the accuracy of small-signal modelling, we were able to show the bias dependence of parasitic resistances which confirmed the effect of source-side bias stressing. The question of channel electron velocities in nitride transistors remains controversial. We determined an effective electron velocity of - 1.9 x 1 o7 cmls through two methods. We first extracted effective velocities through delay time analysis, and then through the small-signal model elements. To our knowledge, this was the first time an equivalent model extraction led to self-consistent electron velocity values for nitride transistors. Finally, our equivalent circuit model showed the correct interrelation between frequency response and access resistances. The cohesive picture of current slump, equivalent circuit model extraction, and delay time analysis gives a high degree of confidence in these results.







A Study of Gamma-radiation-induced Effects in Gallium Nitride Based Devices


Book Description

[Truncated abstract] Over the past decade, the group III-nitride semiconducting compounds (GaN, AlN, InN, and their alloys) have attracted tremendous research efforts due to their unique electronic and optical properties. Their low thermal carrier generation rates and large breakdown fields make them attractive for the development of robust electronic devices capable of reliable operation in extreme conditions, i.e. at high power/voltage levels, high temperatures and in radiation environments. For device applications in radiation environments, such as space electronics, GaN-based devices are expected to manifest superior radiation hardness and reliability without the need for cumber- some and expensive cooling systems and/or radiation shielding. The principle aim of this Thesis is to ascertain the level of susceptibility of current GaN-based elec- tron devices to radiation-induced degradation, by undertaking a detailed study of 60Co gamma-irradiation-induced defects and defect-related effects on the electrical characteristics of n-type GaN-based materials and devices . . . While the irradiation-induced effects on device threshold voltage could be regarded as relatively benign (taking into account that the irradiation levels employed in this study are equivalent to more than 60 years exposure at the average ionising dose rate levels present in space missions), the observed device instabilities and the degradation of gate current characteristics are deleterious effects which will have a significant impact on the performance of AlGaN/GaN HEMTs operating in radiation environments at low temperatures, a combination of conditions which are found in spaceborne electronic systems.




Gallium Nitride (GaN)


Book Description

Addresses a Growing Need for High-Power and High-Frequency Transistors Gallium Nitride (GaN): Physics, Devices, and Technology offers a balanced perspective on the state of the art in gallium nitride technology. A semiconductor commonly used in bright light-emitting diodes, GaN can serve as a great alternative to existing devices used in microelectronics. It has a wide band gap and high electron mobility that gives it special properties for applications in optoelectronic, high-power, and high-frequency devices, and because of its high off-state breakdown strength combined with excellent on-state channel conductivity, GaN is an ideal candidate for switching power transistors. Explores Recent Progress in High-Frequency GaN Technology Written by a panel of academic and industry experts from around the globe, this book reviews the advantages of GaN-based material systems suitable for high-frequency, high-power applications. It provides an overview of the semiconductor environment, outlines the fundamental device physics of GaN, and describes GaN materials and device structures that are needed for the next stage of microelectronics and optoelectronics. The book details the development of radio frequency (RF) semiconductor devices and circuits, considers the current challenges that the industry now faces, and examines future trends. In addition, the authors: Propose a design in which multiple LED stacks can be connected in a series using interband tunnel junction (TJ) interconnects Examine GaN technology while in its early stages of high-volume deployment in commercial and military products Consider the potential use of both sunlight and hydrogen as promising and prominent energy sources for this technology Introduce two unique methods, PEC oxidation and vapor cooling condensation methods, for the deposition of high-quality oxide layers A single-source reference for students and professionals, Gallium Nitride (GaN): Physics, Devices, and Technology provides an overall assessment of the semiconductor environment, discusses the potential use of GaN-based technology for RF semiconductor devices, and highlights the current and emerging applications of GaN.




Gallium-Nitride (GaN) II


Book Description

Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The "Willardson and Beer" Series, as it is widely known, has succeeded in publishing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise indeed that this tradition will be maintained and even expanded.Reflecting the truly interdisciplinary nature of the field that the series covers, the volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in modern industry.







Gallium Nitride Processing for Electronics, Sensors and Spintronics


Book Description

Semiconductor spintronics is expected to lead to a new generation of transistors, lasers and integrated magnetic sensors that can be used to create ultra-low power, high speed memory, logic and photonic devices. Useful spintronic devices will need materials with practical magnetic ordering temperatures and current research points to gallium and aluminium nitride magnetic superconductors as having great potential. This book details current research into the properties of III-nitride semiconductors and their usefulness in novel devices such as spin-polarized light emitters, spin field effect transistors, integrated sensors and high temperature electronics. Written by three leading researchers in nitride semiconductors, the book provides an excellent introduction to gallium nitride technology and will be of interest to all reseachers and industrial practitioners wishing to keep up to date with developments that may lead to the next generation of transistors, lasers and integrated magnetic sensors.