The Interface Envelope


Book Description

In The Interface Envelope, James Ash develops a series of concepts to understand how digital interfaces work to shape the spatial and temporal perception of players. Drawing upon examples from videogame design and work from post-phenomenology, speculative realism, new materialism and media theory, Ash argues that interfaces create envelopes, or localised foldings of space time, around which bodily and perceptual capacities are organised for the explicit production of economic profit. Modifying and developing Bernard Stiegler's account of psychopower and Warren Neidich's account of neuropower, Ash argues the aim of interface designers and publishers is the production of envelope power. Envelope power refers to the ways that interfaces in games are designed to increase users perceptual and habitual capacities to sense difference. Examining a range of examples from specific videogames, Ash identities a series of logics that are key to producing envelope power and shows how these logics have intensified over the last thirty years. In turn, Ash suggests that the logics of interface envelopes in videogames are spreading to other types of interface. In doing so life becomes enveloped as the environments people inhabit becoming increasingly loaded with digital interfaces. Rather than simply negative, Ash develops a series of responses to the potential problematics of interface envelopes and envelope power and emphasizes their pharmacological nature.




The Interface Envelope


Book Description




Modern Construction Envelopes


Book Description

Modern Construction Envelopes deals with the facade and roof as an integral part of the building, allowing a holistic approach to the design of the building envelope and providing greater design freedom. The book is aimed at readers who want to extend their knowledge of wall and roof construction beyond the information given in the Modern Construction Handbook, using state-of-the-art construction principles of modern facade and roof systems. The third edition of this classic has been fully brought up to date; it contains new examples in all chapters and presents the projects in revised, new 3D drawings and in 27 AR applications that can be accessed free of charge via smartphone and tablet.




Glass & Interactive Building Envelopes


Book Description

The concept of tomorrow's towns and cities will be based on new social, economic and technological ideals focused on improving the quality of life. To attain this objective, architects and engineers of today must improve the quality of buildings and establish new principles of building conception. The quality of interior space and the impact of a building on its surroundings depends strongly on the physical interface that separates the outer environment from the inner building space. The conception and realisation of this interface (the envelope) are, therefore, of prime importance.




Compound Semiconductors 1995, Proceedings of the Twenty-Second INT Symposium on Compound Semiconductors held in Cheju Island, Korea, 28 August-2 September, 1995


Book Description

Compound Semiconductors 1995 focuses on emerging applications for GaAs and other compound semiconductors, such as InP, GaN, GaSb, ZnSe, and SiC, in the electronics and optoelectronics industries. The book presents the research and development work in all aspects of compound semiconductors. It reflects the maturity of GaAs as a semiconductor material and the rapidly increasing pool of research information on many other compound semiconductors. Covering the full breadth of the subject, from growth through processing to devices and integrated circuits, this volume provides researchers in materials science, device physics, condensed matter physics, and electrical and electronic engineering with a comprehensive overview of developments in this well-established research area.




Compound Semiconductors 1995, Proceedings of the Twenty-Second INT Symposium on Compound Semiconductors held in Cheju Island, Korea, 28 August-2 September, 1995


Book Description

Compound Semiconductors 1995 focuses on emerging applications for GaAs and other compound semiconductors, such as InP, GaN, GaSb, ZnSe, and SiC, in the electronics and optoelectronics industries. The book presents the research and development work in all aspects of compound semiconductors. It reflects the maturity of GaAs as a semiconductor material and the rapidly increasing pool of research information on many other compound semiconductors. Covering the full breadth of the subject, from growth through processing to devices and integrated circuits, this volume provides researchers in materials science, device physics, condensed matter physics, and electrical and electronic engineering with a comprehensive overview of developments in this well-established research area.




Physics of Electronic Materials


Book Description

A comprehensive textbook explaining the physics of electronic materials and describing numerous practical applications of electronic devices.




Practical Micromechanics of Composite Materials


Book Description

Practical Micromechanics of Composite Materials provides an accessible treatment of micromechanical theories for the analysis and design of multi-phased composites. Written with both students and practitioners in mind and coupled with a fully functional MATLAB code to enable the solution of technologically relevant micromechanics problems, the book features an array of illustrative example problems and exercises highlighting key concepts and integrating the MATLAB code. The MATLAB scripts and functions empower readers to enhance and create new functionality tailored to their needs, and the book and code highly complement one another. The book presents classical lamination theory and then proceeds to describe how to obtain effective anisotropic properties of a unidirectional composite (ply) via micromechanics and multiscale analysis. Calculation of local fields via mechanical and thermal strain concentration tensors is presented in a unified way across several micromechanics theories. The importance of these local fields is demonstrated through the determination of consistent Margins of Safety (MoS) and failure envelopes for thermal and mechanical loading. Finally, micromechanics-based multiscale progressive damage is discussed and implemented in the accompanying MATLAB code. - Emphasizes appropriate application of micromechanics theories to composite behavior - Addresses multiple popular micromechanics theories, which are provided in MATLAB - Discusses stresses and strains resulting from realistic thermal and mechanical loading - Includes availability of solution manual for professors using the book in the classroom




Introduction to Optics and Lasers in Engineering


Book Description

In a very short time, lasers advanced from research interest to increasingly useful, commercially available tools for material processing, precision measurements, surgery, communication, and even entertainment. This 1996 book provides the background in theoretical physics necessary to understand engineering applications. It summarises relevant theories of geometrical optics, physical optics, quantum optics, and laser physics and ties them to applications in such areas as fluid mechanics, combustion, surface analysis, material processing and laser machining. Advanced topics such as laser Doppler velocimetry, laser-induced fluorescence, and holography are clearly and thoroughly explained. The book includes numerous examples and homework problems. A unique feature is the advanced research problems in each chapter that simulate real-world research and encourage independent reading and analysis.




Materials for Subsurface Land Drainage Systems


Book Description

Reliable subsurface drainage systems for groundwater table and salinity control are needed to maintain or enhance the productivity of irrigated lands and to contribute to the rural development of lowlands in the humid tropic. This publication presents guidelines to assess the need for envelopes and for the selection of appropriate materials (i.e. pipes and envelopes) for the proper and lasting performance of subsurface drainage systems. In addition, it also contains guidelines for adequate installation and maintenance of drainage materials as well as the required specifications and standards of such materials, which may be used in tender documents for implementation of subsurface drainage works. Practical guidelines for the implementation of laboratory and field investigations to evaluate the performance of drainage materials have also been included.--Publisher's description.