Three-Dimensional Integrated Circuit Design


Book Description

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization




Thermal and Power Management of Integrated Circuits


Book Description

In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.




Thermal Testing of Integrated Circuits


Book Description

Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.




Thermally-Aware Design


Book Description

Provides an overview of analysis and optimization techniques for thermally-aware chip design.




Electrical Engineering Applications


Book Description

The application of BEM in all fields of engineering and science has progressed at an accelerate rate since the first book on the method appeared in the late seventies. In particular the advantages of BEM for potential problems are essential to solve a whole range of electrical engineering problems. Previous volumes in this series have focussed on the state of the art in other fields while this volume discusses only problems related to electrical engineering. The book reviews a series of important applications such as the design of semiconductor devices and their thermal analysis. The following two chapters concentrate on the study of galvanic corrosion and cathodic protection. Chapter 4 deals with the design of capacitance transducers. The next three chapters concentrate on the applications of the method to simulate electrochemical problems with special reference to Plating Process. The last chapter in the book discusses the case of inverse problems in electrical engineering and presents some applications including their use in tomography.




Modeling of Electrical Overstress in Integrated Circuits


Book Description

Electrical overstress (EOS) and Electrostatic discharge (ESD) pose one of the most dominant threats to integrated circuits (ICs). These reliability concerns are becoming more serious with the downward scaling of device feature sizes. Modeling of Electrical Overstress in Integrated Circuits presents a comprehensive analysis of EOS/ESD-related failures in I/O protection devices in integrated circuits. The design of I/O protection circuits has been done in a hit-or-miss way due to the lack of systematic analysis tools and concrete design guidelines. In general, the development of on-chip protection structures is a lengthy expensive iterative process that involves tester design, fabrication, testing and redesign. When the technology is changed, the same process has to be repeated almost entirely. This can be attributed to the lack of efficient CAD tools capable of simulating the device behavior up to the onset of failure which is a 3-D electrothermal problem. For these reasons, it is important to develop and use an adequate measure of the EOS robustness of integrated circuits in order to address the on-chip EOS protection issue. Fundamental understanding of the physical phenomena leading to device failures under ESD/EOS events is needed for the development of device models and CAD tools that can efficiently describe the device behavior up to the onset of thermal failure. Modeling of Electrical Overstress in Integrated Circuits is for VLSI designers and reliability engineers, particularly those who are working on the development of EOS/ESD analysis tools. CAD engineers working on development of circuit level and device level electrothermal simulators will also benefit from the material covered. This book will also be of interest to researchers and first and second year graduate students working in semiconductor devices and IC reliability fields.




Physical Design for 3D Integrated Circuits


Book Description

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.




Mixed Design of Integrated Circuits and Systems


Book Description

Very fast advances in IC technologies have brought new challenges into the physical design of integrated systems. The emphasis on system performance, in lately developed applications, requires timing and power constraints to be considered at each stage of physical design. The size of ICs is decreasing continuously, and the density of power dissipated in the circuits is growing rapidly. The first challenge is the Information Technology where new materials, devices, telecommunication and multimedia facilities are developed. The second one is the Biomedical Science and Biotechnology. The utilisation of bloodless surgery is possible now because of wide micro-sensors and micro-actuators application. Nowadays, the modern micro systems can be implanted directly into the human body and the medicine can be applied right in the proper time and place in the patient body. The low-power devices are being developed particularly for medical and space applications. This has created for designers in all scientific domains new possibilities which must be handed down to the future generations of designers. In this spirit, we organised the Fourth International Workshop "MIXED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS" in order to provide an international forum for discussion and the exchange of information on education, teaching experiences, training and technology transfer in the area of microelectronics and microsystems.




Electrothermal Analysis of VLSI Systems


Book Description

This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.




Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore


Book Description

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging