Thermal Analysis of Silicone-ceramic Systems
Author : William Alan Poolos
Publisher :
Page : 134 pages
File Size : 42,78 MB
Release : 1971
Category : Silicones
ISBN :
Author : William Alan Poolos
Publisher :
Page : 134 pages
File Size : 42,78 MB
Release : 1971
Category : Silicones
ISBN :
Author : David E. Myers
Publisher :
Page : 52 pages
File Size : 41,37 MB
Release : 2000
Category : Ceramics
ISBN :
Author :
Publisher : ASM International
Page : 1234 pages
File Size : 40,67 MB
Release : 1989-11-01
Category : Technology & Engineering
ISBN : 9780871702852
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author : William Buford Campbell
Publisher :
Page : 230 pages
File Size : 37,38 MB
Release : 1967
Category : Ceramics
ISBN :
Author : Paul Gabbott
Publisher : John Wiley & Sons
Page : 480 pages
File Size : 37,10 MB
Release : 2008-04-30
Category : Science
ISBN : 0470698128
Thermal Analysis techniques are used in a wide range of disciplines, from pharmacy and foods to polymer science, materials and glasses; in fact any field where changes in sample behaviour are observed under controlled heating or controlled cooling conditions. The wide range of measurements possible provide fundamental information on the material properties of the system under test, so thermal analysis has found increasing use both in basic characterisation of materials and in a wide range of applications in research, development and quality control in industry and academia. Principles and Applications of Thermal Analysis is written by manufacturers and experienced users of thermal techniques. It provides the reader with sound practical instruction on how to use the techniques and gives an up to date account of the principle industrial applications. By covering basic thermogravimetric analysis (TGA), differential scanning calorimetry (DSC) including the new approach of Fast Scanning DSC, together with dynamic mechanical analysis (DMA /TMA) methods, then developing the discussion to encompass industrial applications, the book serves as an ideal introduction to the technology for new users. With a strong focus on practical issues and relating the measurements to the physical behaviour of the materials under test, the book will also serve as an important reference for experienced analysts.
Author : O. Toft Sørensen
Publisher : Springer Science & Business Media
Page : 265 pages
File Size : 23,13 MB
Release : 2013-03-14
Category : Science
ISBN : 1475737351
Sample Controlled Thermal Analysis gives a short presentation of the spirit and history of SCTA and then focuses on: basic SCTA techniques, applications of SCTA in kinetic studies and applications in the study of ceramics, adsorbents and catalysts. Finally the expected future development of SCTA is discussed. This book is an invaluable reference for materials scientists, chemists, geologists, and engineers involved in the development of new materials, the manufacturing processes and quality control. It is also useful for research in solid state chemistry, materials science, materials in general, and analytical chemistry. Producers of thermoanalytical equipment and manufacturers of catalysts, technological ceramics and adsorbents for industrial or environment applications will find this an important resource.
Author :
Publisher :
Page : 376 pages
File Size : 43,63 MB
Release : 1995
Category : Aeronautics
ISBN :
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Author :
Publisher :
Page : 1088 pages
File Size : 27,77 MB
Release : 1968
Category : Nuclear energy
ISBN :
Author : Madhusudhana R. Dowlapalli
Publisher :
Page : 240 pages
File Size : 26,35 MB
Release : 2004
Category : Borides
ISBN :
Author :
Publisher :
Page : 206 pages
File Size : 36,58 MB
Release : 1963
Category : Science
ISBN :