› › Thermal And Electrical Parasitic Modeling For Multi Chip Power Module Layout Synthesis

Wide Bandgap Power Semiconductor Packaging

Author : Katsuaki Suganuma

Publisher : Woodhead Publishing

Page : 242 pages

File Size : 22,4 MB

Release : 2018-05-28

Category : Technology & Engineering

ISBN : 0081020953

Get eBook

Book Description

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. - Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance - Provides the latest research on potential solutions, with an eye towards the end goal of system integration - Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates



Conceptual Design of Multichip Modules and Systems

Author : Peter A. Sandborn

Publisher : Springer Science & Business Media

Page : 270 pages

File Size : 11,81 MB

Release : 2013-03-14

Category : Technology & Engineering

ISBN : 1475748418

Get eBook

Book Description

Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.



Index to IEEE Publications

Author : Institute of Electrical and Electronics Engineers

Publisher :

Page : 1234 pages

File Size : 21,23 MB

Release : 1998

Category : Electric engineering

ISBN :

Get eBook

Book Description

Issues for 1973- cover the entire IEEE technical literature.



Science Abstracts

Author :

Publisher :

Page : 1360 pages

File Size : 43,3 MB

Release : 1995

Category : Electrical engineering

ISBN :

Get eBook

Book Description



Multiphysics Simulation by Design for Electrical Machines, Power Electronics and Drives

Author : Marius Rosu

Publisher : John Wiley & Sons

Page : 312 pages

File Size : 29,66 MB

Release : 2017-12-18

Category : Science

ISBN : 1119103444

Get eBook

Book Description

Presents applied theory and advanced simulation techniques for electric machines and drives This book combines the knowledge of experts from both academia and the software industry to present theories of multiphysics simulation by design for electrical machines, power electronics, and drives. The comprehensive design approach described within supports new applications required by technologies sustaining high drive efficiency. The highlighted framework considers the electric machine at the heart of the entire electric drive. The book also emphasizes the simulation by design concept—a concept that frames the entire highlighted design methodology, which is described and illustrated by various advanced simulation technologies. Multiphysics Simulation by Design for Electrical Machines, Power Electronics and Drives begins with the basics of electrical machine design and manufacturing tolerances. It also discusses fundamental aspects of the state of the art design process and includes examples from industrial practice. It explains FEM-based analysis techniques for electrical machine design—providing details on how it can be employed in ANSYS Maxwell software. In addition, the book covers advanced magnetic material modeling capabilities employed in numerical computation; thermal analysis; automated optimization for electric machines; and power electronics and drive systems. This valuable resource: Delivers the multi-physics know-how based on practical electric machine design methodologies Provides an extensive overview of electric machine design optimization and its integration with power electronics and drives Incorporates case studies from industrial practice and research and development projects Multiphysics Simulation by Design for Electrical Machines, Power Electronics and Drives is an incredibly helpful book for design engineers, application and system engineers, and technical professionals. It will also benefit graduate engineering students with a strong interest in electric machines and drives.





Thermally-Aware Design

Author : Yong Zhan

Publisher : Now Publishers Inc

Page : 131 pages

File Size : 19,13 MB

Release : 2008

Category : Integrated circuits

ISBN : 1601981708

Get eBook

Book Description

Provides an overview of analysis and optimization techniques for thermally-aware chip design.





High Temperature Electronics

Author : F. Patrick McCluskey

Publisher : CRC Press

Page : 354 pages

File Size : 49,29 MB

Release : 1996-12-13

Category : Technology & Engineering

ISBN : 9780849396236

Get eBook

Book Description

The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.



The Engineering Index Annual

Author :

Publisher :

Page : 2264 pages

File Size : 49,28 MB

Release : 1992

Category : Engineering

ISBN :

Get eBook

Book Description

Since its creation in 1884, Engineering Index has covered virtually every major engineering innovation from around the world. It serves as the historical record of virtually every major engineering innovation of the 20th century. Recent content is a vital resource for current awareness, new production information, technological forecasting and competitive intelligence. The world?s most comprehensive interdisciplinary engineering database, Engineering Index contains over 10.7 million records. Each year, over 500,000 new abstracts are added from over 5,000 scholarly journals, trade magazines, and conference proceedings. Coverage spans over 175 engineering disciplines from over 80 countries. Updated weekly.