Proceedings


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Memorandum


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On-Chip Communication Architectures


Book Description

Over the past decade, system-on-chip (SoC) designs have evolved to address the ever increasing complexity of applications, fueled by the era of digital convergence. Improvements in process technology have effectively shrunk board-level components so they can be integrated on a single chip. New on-chip communication architectures have been designed to support all inter-component communication in a SoC design. These communication architecture fabrics have a critical impact on the power consumption, performance, cost and design cycle time of modern SoC designs. As application complexity strains the communication backbone of SoC designs, academic and industrial R&D efforts and dollars are increasingly focused on communication architecture design. On-Chip Communication Architecures is a comprehensive reference on concepts, research and trends in on-chip communication architecture design. It will provide readers with a comprehensive survey, not available elsewhere, of all current standards for on-chip communication architectures. - A definitive guide to on-chip communication architectures, explaining key concepts, surveying research efforts and predicting future trends - Detailed analysis of all popular standards for on-chip communication architectures - Comprehensive survey of all research on communication architectures, covering a wide range of topics relevant to this area, spanning the past several years, and up to date with the most current research efforts - Future trends that with have a significant impact on research and design of communication architectures over the next several years
















Interconnect Technology and Design for Gigascale Integration


Book Description

This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.




ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis


Book Description

The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.