Book Description
This presentation discusses the thermal performance and reliability of bonded interfaces for power electronics packaging applications.
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Page : 0 pages
File Size : 26,60 MB
Release : 2013
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This presentation discusses the thermal performance and reliability of bonded interfaces for power electronics packaging applications.
Author : Yong Liu
Publisher : Springer Science & Business Media
Page : 606 pages
File Size : 20,60 MB
Release : 2012-02-15
Category : Technology & Engineering
ISBN : 1461410533
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Author : National Academies of Sciences, Engineering, and Medicine
Publisher : National Academies Press
Page : 255 pages
File Size : 14,65 MB
Release : 2017-07-28
Category : Science
ISBN : 0309456908
Review of the Research Program of the U.S. DRIVE Partnership: Fifth Report follows on four previous reviews of the FreedomCAR and Fuel Partnership, which was the predecessor of the U.S. DRIVE Partnership. The U.S. DRIVE (Driving Research and Innovation for Vehicle Efficiency and Energy Sustainability) vision, according to the charter of the Partnership, is this: American consumers have a broad range of affordable personal transportation choices that reduce petroleum consumption and significantly reduce harmful emissions from the transportation sector. Its mission is as follows: accelerate the development of pre-competitive and innovative technologies to enable a full range of efficient and clean advanced light-duty vehicles (LDVs), as well as related energy infrastructure. The Partnership focuses on precompetitive research and development (R&D) that can help to accelerate the emergence of advanced technologies to be commercialization-feasible. The guidance for the work of the U.S. DRIVE Partnership as well as the priority setting and targets for needed research are provided by joint industry/government technical teams. This structure has been demonstrated to be an effective means of identifying high-priority, long-term precompetitive research needs for each technology with which the Partnership is involved. Technical areas in which research and development as well as technology validation programs have been pursued include the following: internal combustion engines (ICEs) potentially operating on conventional and various alternative fuels, automotive fuel cell power systems, hydrogen storage systems (especially onboard vehicles), batteries and other forms of electrochemical energy storage, electric propulsion systems, hydrogen production and delivery, and materials leading to vehicle weight reductions.
Author : Márta Rencz
Publisher : MDPI
Page : 222 pages
File Size : 42,14 MB
Release : 2019-11-18
Category : Technology & Engineering
ISBN : 3039217364
With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.
Author : Giuseppe Ferri
Publisher : MDPI
Page : 171 pages
File Size : 25,66 MB
Release : 2018-12-07
Category : Computers
ISBN : 3038973769
This book is a printed edition of the Special Issue "Interface Circuits for Microsensor Integrated Systems" that was published in Micromachines
Author : Shiquan Zhou
Publisher : CRC Press
Page : 1162 pages
File Size : 12,38 MB
Release : 2017-09-19
Category : Science
ISBN : 1351652753
The 2016 2nd International Conference on Energy Equipment Science and Engineering (ICEESE 2016) was held on November 12-14, 2016 in Guangzhou, China. ICEESE 2016 brought together innovative academics and industrial experts in the field of energy equipment science and engineering to a common forum. The primary goal of the conference is to promote research and developmental activities in energy equipment science and engineering and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in energy equipment science and engineering and related areas. This second volume of the two-volume set of proceedings covers the field of Structural and Materials Sciences, and Computer Simulation & Computer and Electrical Engineering.
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Publisher :
Page : 1220 pages
File Size : 10,57 MB
Release : 2004
Category : Electronic apparatus and appliances
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Page : 92 pages
File Size : 33,34 MB
Release : 1998
Category : Electronic packaging
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Author : Kim S. Siow
Publisher : Springer
Page : 292 pages
File Size : 37,56 MB
Release : 2019-01-29
Category : Technology & Engineering
ISBN : 3319992562
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Author : Dongming Zhu
Publisher : John Wiley & Sons
Page : 137 pages
File Size : 23,48 MB
Release : 2009-12-15
Category : Technology & Engineering
ISBN : 0470584270
This volume is a useful resource for understanding the most valuable aspects of advanced ceramic coatings and interfaces. Containing twelve contributed papers from the symposium, topics include vibration damping coatings, thermal and environmental barrier coating processing, testing and life modeling, non-destructive evaluation, multifunctional coatings and interfaces, highlighting the state-of-the-art ceramic coatings technologies for various critical engineering applications.