Thermal Phenomena in Phase Change Memory


Book Description

Information storage and accessibility form the foundation of many modern electronic systems. High speed nonvolatile memory (NVM) technologies retain data without consuming power, driving the rapid growth of the portable consumer electronics market. Phase change memory (PCM) is an emerging NVM offering exceptional speed, storage density, and cycling endurance. This work uses novel multiphysics models to quantify the importance of thermal phenomena in PCM. It extends optical thermometry techniques to resolve the thermal transport physics critical for device functionality. Fully coupled finite element calculations capture the electrothermal and phase change processes in a confined cell device. The simulations demonstrate the critical role thermal boundary resistance (TBR) plays in reducing programming current. This result suggests that interface engineering can significantly reduce programming current. Compact electrothermal models use reduced cell geometries to accurately predict scaling in a variety of device geometries. These models demonstrate that the distribution of thermal resistances is the key design parameter for reducing the programming current. Nanosecond transient thermoreflectance (TTR) measurements on a variety of chalcogenide stoichiometries show that the effective thermal conductivity depends primarily on the material phase. This work extends nanosecond TTR up to 340°C to measure the thickness and temperature dependent effective thermal conductivity of GeSbTe (2:2:5) (GST) in the as-deposited, fcc, and hcp phases. Process dependent material defects, partial crystallization, and TBR all significantly alter the effective thermal conductivity. Picosecond time-domain thermoreflectance (TDTR) measurements establish the Al/TiN TBR, TiN/fcc GST TBR, and intrinsic fcc GST thermal conductivity up to 325°C. An original multi-sample, thickness-implicit data extraction technique uniquely separates the spatial distribution of thermal properties. The intrinsic conductivity increases slowly with temperature, consistent with materials with high defect and vacancy concentrations. The TiN/fcc GST TBR dominates the device thermal resistance and is the key factor determining the programming current.




Electro-thermal Phenomena in Phase Change Memory


Book Description

Recent progress in materials science and the trends of nanoscale electronics have brought greater attention to the transport of heat and electricity in confined geometries. Research on developing metrology and understanding the electro-thermal phenomena can make a significant improvement in novel electronic devices such as phase change memory. Phase change memory is a particularly promising candidate for next-generation data storage because of its exceptional scalability and cycle endurance. The phase change memory devices store information through thermally-induced phase transitions of Ge2Sb2Te5 and related compounds. Because the temperature governs the phase change processes, thermal conduction in Ge2Sb2Te5 films strongly influences the device figures of merit including the programming time and the required energy. The present doctoral research develops innovative metrologies to characterize the thermal properties of Ge2Sb2Te5 films that are relevant for device operations and quantifies the importance of electro-thermal phenomena in phase change memory. Large temperature transients and rapid cycling of phase change memory pose unique challenges for thermal characterization of phase change materials. Here we develop experimental structures based on a micro-thermal stage that reproduces the heating time scales and the temperature excursions of phase change memory devices in the characterization samples. The measurement results show the thermal conductivity of Ge2Sb2Te5 films from room temperature to above 400 °C in amorphous, face-centered cubic, and hexagonal close-packed phases. Another key benefit of the micro-thermal stage is that a single structure enables simultaneous characterization of thermal and electrical properties using four-probe electrical-resistance thermometry with a programmable Ge2Sb2Te5 bridge. This work reports the in-plane electrical resistance and the out-of-plane thermal conductivity during repetitive cycling. We identify electron contribution to the thermal transport in Ge2Sb2Te5 films using the electrical properties and the Wiedmann Franz Law. The electrons are responsible for up to 70 % of the thermal transport in the hexagonal closed-packed phase, but phonons dominate the thermal transport in the amorphous and the face-centered cubic phases, which are consistent with the Einstein model for highly disordered materials. Phase change memory devices experience both large current densities and temperature excursions exceeding 600 °C, and these extreme conditions increase the relevance of thermoelectric transport and provide an ideal opportunity for studying their impact. This work develops a novel silicon-on-insulator experimental structure to measure the phase and temperature-dependent thermoelectric properties of Ge2Sb2Te5 films including the first data for films of thickness down to 25 nm. The Ge2Sb2Te5 films annealed at different temperatures contain varying fractions of the amorphous and crystalline phases, which strongly influence the thermoelectric properties. The data are consistent with modeling based on effective medium theory and suggest that careful consideration of phase purity is needed to account for thermoelectric transport. The simulations considering the thermoelectric heating show a Ge2Sb2Te5 peak temperature increase up to 44 % and a decrease in the programming power up to 30 %. The simulation results and the analysis discussed here provide physical insights into thermal phenomena and cell optimization opportunities.




Phase Change Memory


Book Description

This book describes the physics of phase change memory devices, starting from basic operation to reliability issues. The book gives a comprehensive overlook of PCM with particular attention to the electrical transport and the phase transition physics between the two states. The book also contains design engineering details on PCM cell architecture, PCM cell arrays (including electrical circuit management), as well as the full spectrum of possible future applications.




Durable Phase-Change Memory Architectures


Book Description

Advances in Computers, Volume 118, the latest volume in this innovative series published since 1960, presents detailed coverage of new advancements in computer hardware, software, theory, design and applications. Chapters in this updated release include Introduction to non-volatile memory technologies, The emerging phase-change memory, Phase-change memory architectures, Inter-line level schemes for handling hard errors in PCMs, Handling hard errors in PCMs by using intra-line level schemes, and Addressing issues with MLC Phase-change Memory. Gives a comprehensive overlook of new memory technologies, including PCM Provides reliability features with an in-depth discussion of physical mechanisms that are currently limiting PCM capabilities Covers the work of well-known authors and researchers in the field Includes volumes that are devoted to single themes or subfields of computer science




Emerging Nanoelectronic Devices


Book Description

Emerging Nanoelectronic Devices focuses on the future direction of semiconductor and emerging nanoscale device technology. As the dimensional scaling of CMOS approaches its limits, alternate information processing devices and microarchitectures are being explored to sustain increasing functionality at decreasing cost into the indefinite future. This is driving new paradigms of information processing enabled by innovative new devices, circuits, and architectures, necessary to support an increasingly interconnected world through a rapidly evolving internet. This original title provides a fresh perspective on emerging research devices in 26 up to date chapters written by the leading researchers in their respective areas. It supplements and extends the work performed by the Emerging Research Devices working group of the International Technology Roadmap for Semiconductors (ITRS). Key features: • Serves as an authoritative tutorial on innovative devices and architectures that populate the dynamic world of “Beyond CMOS” technologies. • Provides a realistic assessment of the strengths, weaknesses and key unknowns associated with each technology. • Suggests guidelines for the directions of future development of each technology. • Emphasizes physical concepts over mathematical development. • Provides an essential resource for students, researchers and practicing engineers.




Phase Change in Mechanics


Book Description

Predictive theories of phenomena involving phase change with applications in engineering are investigated in this volume, e.g. solid-liquid phase change, volume and surface damage, and phase change involving temperature discontinuities. Many other phase change phenomena such as solid-solid phase change in shape memory alloys and vapor-liquid phase change are also explored. Modeling is based on continuum thermo-mechanics. This involves a renewed principle of virtual power introducing the power of the microscopic motions responsible for phase change. This improvement yields a new equation of motion related to microscopic motions, beyond the classical equation of motion for macroscopic motions. The new theory sensibly improves the phase change modeling. For example, when warm rain falls on frozen soil, the dangerous black ice phenomenon can be comprehensively predicted. In addition, novel equations predict the evolution of clouds, which are themselves a mixture of air, liquid water and vapor.




Phase Change Memory


Book Description

As conventional memory technologies such as DRAM and Flash run into scaling challenges, architects and system designers are forced to look at alternative technologies for building future computer systems. This synthesis lecture begins by listing the requirements for a next generation memory technology and briefly surveys the landscape of novel non-volatile memories. Among these, Phase Change Memory (PCM) is emerging as a leading contender, and the authors discuss the material, device, and circuit advances underlying this exciting technology. The lecture then describes architectural solutions to enable PCM for main memories. Finally, the authors explore the impact of such byte-addressable non-volatile memories on future storage and system designs. Table of Contents: Next Generation Memory Technologies / Architecting PCM for Main Memories / Tolerating Slow Writes in PCM / Wear Leveling for Durability / Wear Leveling Under Adversarial Settings / Error Resilience in Phase Change Memories / Storage and System Design With Emerging Non-Volatile Memories




Phase Change Materials


Book Description

"Phase Change Materials: Science and Applications" provides a unique introduction of this rapidly developing field. Clearly written and well-structured, this volume describes the material science of these fascinating materials from a theoretical and experimental perspective. Readers will find an in-depth description of their existing and potential applications in optical and solid state storage devices as well as reconfigurable logic applications. Researchers, graduate students and scientists with an interest in this field will find "Phase Change Materials" to be a valuable reference.




Advances in Non-volatile Memory and Storage Technology


Book Description

New solutions are needed for future scaling down of nonvolatile memory. Advances in Non-volatile Memory and Storage Technology provides an overview of developing technologies and explores their strengths and weaknesses. After an overview of the current market, part one introduces improvements in flash technologies, including developments in 3D NAND flash technologies and flash memory for ultra-high density storage devices. Part two looks at the advantages of designing phase change memory and resistive random access memory technologies. It looks in particular at the fabrication, properties, and performance of nanowire phase change memory technologies. Later chapters also consider modeling of both metal oxide and resistive random access memory switching mechanisms, as well as conductive bridge random access memory technologies. Finally, part three looks to the future of alternative technologies. The areas covered include molecular, polymer, and hybrid organic memory devices, and a variety of random access memory devices such as nano-electromechanical, ferroelectric, and spin-transfer-torque magnetoresistive devices. Advances in Non-volatile Memory and Storage Technology is a key resource for postgraduate students and academic researchers in physics, materials science, and electrical engineering. It is a valuable tool for research and development managers concerned with electronics, semiconductors, nanotechnology, solid-state memories, magnetic materials, organic materials, and portable electronic devices. - Provides an overview of developing nonvolatile memory and storage technologies and explores their strengths and weaknesses - Examines improvements to flash technology, charge trapping, and resistive random access memory - Discusses emerging devices such as those based on polymer and molecular electronics, and nanoelectromechanical random access memory (RAM)




Electronic Processes in Non-Crystalline Materials


Book Description

A reissue of a classic Oxford text. The book sets out theoretical concepts and makes comparisons with experiments for a wide variety of phenomena in non-crystalline materials.