Author : A.C. Tan
Publisher : Springer Science & Business Media
Page : 358 pages
File Size : 35,65 MB
Release : 1992-11-30
Category : Technology & Engineering
ISBN : 9780412482403
The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.
Author : A. C. Tan
Publisher :
Page : 326 pages
File Size : 37,55 MB
Release : 1993
Category : Electroplating
ISBN : 9780442317126
Resume på engelsk.
Author : A. C. Tan
Publisher : World Scientific
Page : 272 pages
File Size : 44,98 MB
Release : 1989
Category : Technology & Engineering
ISBN : 9789971506797
This monograph provides an insight review on semiconductor device lead soldering process where various process and material controls are discussed with the aim of achieving zero defect soldering. Quality problems like solderability and visual mechanical problems are discussed and ways to overcome are suggested. Related topics like the corrosion in the microelectronic devices (chip corrosion and lead tarnishing), various techniques like ion chromatography and surface techniques are presented in terms of their applications in the areas of semiconductor device assembly.
Author : Yuan-Ting Zhang
Publisher : Springer Science & Business Media
Page : 380 pages
File Size : 46,79 MB
Release : 2013-11-20
Category : Technology & Engineering
ISBN : 3319030051
This volume presents the proceedings of the International Conference on Health Informatics (ICHI). The conference was a new special topic conference initiative by the International Federation of Medical and Biological Engineering (IFMBE), held in Vilamoura, Portugal on 7-9 November, 2013. The main theme of the ICHI2013 was “Integrating Information and Communication Technologies with Biomedicine for Global Health”. The proceedings offer a unique forum to examine enabling technologies of sensors, devices and systems that optimize the acquisition, transmission, processing, storage, retrieval of biomedical and health information as well as to report novel clinical applications of health information systems and the deployment of m-Health, e-Health, u-Health, p-Health and Telemedicine.
Author : Andrea Chen
Publisher : CRC Press
Page : 218 pages
File Size : 37,92 MB
Release : 2016-04-19
Category : Technology & Engineering
ISBN : 1000218619
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Author : Thomas George Wiegele
Publisher :
Page : 446 pages
File Size : 44,9 MB
Release : 1995
Category :
ISBN :
Author : Mahmood Aliofkhazraei
Publisher : BoD – Books on Demand
Page : 320 pages
File Size : 17,87 MB
Release : 2015-12-02
Category : Science
ISBN : 9535122134
The electroplating was widely used to electrodeposit the nanostructures because of its relatively low deposition temperature, low cost and controlling the thickness of the coatings. With advances in electronics and microprocessor, the amount and form of the electrodeposition current applied can be controlled. The pulse electrodeposition has the interesting advantages such as higher current density application, higher efficiency and more variable parameters compared to direct current density. This book collects new developments about electroplating and its use in nanotechnology.
Author :
Publisher :
Page : 1162 pages
File Size : 45,15 MB
Release : 1995
Category : Chemistry, Technical
ISBN :
Author : OECD
Publisher : OECD Publishing
Page : 224 pages
File Size : 33,62 MB
Release : 2014-09-03
Category :
ISBN : 9264221069
This emission scenario document (ESD) for chemicals used in the electronics industry provides information on the sources and release pathways of chemicals during various processing techniques in this varied industry sector, to help estimate releases of chemicals into the environment.
Author : R. C. GUPTA
Publisher : PHI Learning Pvt. Ltd.
Page : 359 pages
File Size : 15,61 MB
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 8120346009
This comprehensive book deals with the environmental aspects of metallurgical industries, including ferrous (iron and steel, DRI units, EAF units, ferroalloys and foundries) and non-ferrous (aluminium, copper, lead and zinc) plants. The text, comprising of eight chapters, discusses fundamental aspects of environment management, various energy sources available on the earth and environment awareness required for sustained economic growth. The book provides a thorough understanding of pollution sources in metallurgical industries and their abatement techniques. It also provides details of energy management in metal industry and enumerates factors for metallurgical plant location and layout. Furthermore, it presents health and safety guidelines for metallurgical professionals. The text concludes with discussion on basic legislations related to environment and labour. This book is primarily designed for undergraduate students of metallurgical engineering. Besides, it will also be useful as a ready reference source to professionals associated with metallurgical industries. KEY FEATURES Coverage of various types of environmental issues such as air emission, toxic effluents, solid waste, thermal discharge, noise and radiation. Analysis of renewable and non-renewable energy sources on the earth with current energy usage pattern and future consumption pattern. Description of various activities in the metallurgical units along with discussion of sources of pollution and abatement techniques. Guidelines for the plant location and layout. Basic information about labour health and safety, environmental legislations, labour laws, ISO 14000, carbon credit, etc.
