Troubleshooting Electronic Assembly


Book Description

BoardTalk had its humble beginnings as a SMT expert Q&A session with Phil Zarrow and Jim Hall at an SMTAI conference. Ten years and over 200 episodes later, the "Assembly Brothers - Pick and Place" have transcribed their informative discussions from CircuitInsight.com, where BoardTalk is streamed all over the world.




Soldering in Electronics Assembly


Book Description

Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. - A practical guide for the industry covering all the main soldering processes currently in use - Cleaning, faults, troubleshooting and standards are all major topics - Considers safety and solder process quality assessment



















Electronic Assembly Fabrication


Book Description

Printed circuit history and overview. Development and fabrication of IC chips. Packaging of IC chips. Printed circuit board fabrication.





Book Description




Contamination of Electronic Assemblies


Book Description

Contamination problems have become a major factor in determining the manufacturability, quality, and reliability of electronic assemblies. Understanding the mechanics and chemistry of contamination has become necessary for improving quality and reliability and reducing costs of electronic assemblies. Designed as a practical guide, Contamination of Electronic Assemblies presents a generalized overview of contamination problems and serves as a problem-solving reference point. It takes a step-by-step approach to identifying contaminants and their effects on electronic products at each level of manufacture. The text is divided into four sections: Laminate Manufacturing, Substrate Fabrication, Printed Wiring Board Assembly, and Conformal Coatings. These sections discuss all aspects of contamination of electronic assemblies, from the manufacture of glass fibers used in the laminates to the complete assembly of the finished product. The authors present detection and control methods that can help you reduce defects during the manufacturing process. With tables, figures, and fishbone diagrams serving as a quick reference, Contamination of Electronic Assemblies will help you familiarize yourself with the origination, detection, measurement, control, and prevention of contamination in electronic assemblies.