ULSI Process Integration II
Author : Cor L. Claeys
Publisher : The Electrochemical Society
Page : 636 pages
File Size : 22,84 MB
Release : 2001
Category : Technology & Engineering
ISBN : 9781566773089
Author : Cor L. Claeys
Publisher : The Electrochemical Society
Page : 636 pages
File Size : 22,84 MB
Release : 2001
Category : Technology & Engineering
ISBN : 9781566773089
Author : C. Claeys
Publisher : The Electrochemical Society
Page : 429 pages
File Size : 40,91 MB
Release : 2011
Category :
ISBN : 1607682613
Author : C. Claeys
Publisher : The Electrochemical Society
Page : 547 pages
File Size : 26,58 MB
Release : 2009-09
Category : Integrated circuits
ISBN : 1566777445
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
Author : Cor L. Claeys
Publisher : The Electrochemical Society
Page : 509 pages
File Size : 23,7 MB
Release : 2007
Category : Integrated circuits
ISBN : 1566775728
The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.
Author : Electrochemical Society. Meeting
Publisher : The Electrochemical Society
Page : 620 pages
File Size : 20,15 MB
Release : 2003
Category : Technology & Engineering
ISBN : 9781566773768
Author : Androula G. Nassiopoulou
Publisher : World Scientific
Page : 409 pages
File Size : 49,60 MB
Release : 2001
Category : Technology & Engineering
ISBN : 9810247699
This volume contains papers on the following: CMOS devices and devices based on compound semiconductors; processing; silicon integrated technology and integrated circuit design; quantum physics; nanotechnology; nanodevices, sensors and microsystems. The latest news and future challenges in these fields are presented in invited papers.
Author : Androula G Nassiopoulou
Publisher : World Scientific
Page : 409 pages
File Size : 32,68 MB
Release : 2001-10-19
Category : Technology & Engineering
ISBN : 9814489999
This volume contains papers on the following: CMOS devices and devices based on compound semiconductors; processing; silicon integrated technology and integrated circuit design; quantum physics; nanotechnology; nanodevices, sensors and microsystems. The latest news and future challenges in these fields are presented in invited papers.
Author : Electrochemical Society. Electronics Division
Publisher : The Electrochemical Society
Page : 506 pages
File Size : 21,27 MB
Release : 2002
Category : Technology & Engineering
ISBN : 9781566773287
Author : Cor L. Claeys
Publisher : The Electrochemical Society
Page : 408 pages
File Size : 39,95 MB
Release : 1999
Category : Computers
ISBN : 9781566772419
Author : C. Claeys
Publisher : The Electrochemical Society
Page : 335 pages
File Size : 43,95 MB
Release : 2015
Category :
ISBN : 1607686759