Author : Erin Catherine Jones
Publisher :
Page : 428 pages
File Size : 11,67 MB
Release : 1996
Category :
ISBN :
Author :
Publisher :
Page : 2692 pages
File Size : 41,26 MB
Release : 2002
Category : Chemistry
ISBN :
Author :
Publisher :
Page : 980 pages
File Size : 42,3 MB
Release : 1993
Category : Electrical engineering
ISBN :
Author :
Publisher :
Page : 2304 pages
File Size : 20,64 MB
Release : 1997
Category : Electrical engineering
ISBN :
Author : Nihon Butsuri Gakkai
Publisher :
Page : 1022 pages
File Size : 49,96 MB
Release : 2001
Category : Electronic journals
ISBN :
Author : Cheol Seong Hwang
Publisher : Springer Science & Business Media
Page : 266 pages
File Size : 14,23 MB
Release : 2013-10-18
Category : Science
ISBN : 146148054X
Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Author : Stephen A. Campbell
Publisher : OUP USA
Page : 0 pages
File Size : 14,14 MB
Release : 2008-01-10
Category : Technology & Engineering
ISBN : 9780195320176
Designed for advanced undergraduate or first-year graduate courses in semiconductor or microelectronic fabrication, the third edition of Fabrication Engineering at the Micro and Nanoscale provides a thorough and accessible introduction to all fields of micro and nano fabrication.
Author : Marin Alexe
Publisher : Springer Science & Business Media
Page : 524 pages
File Size : 16,22 MB
Release : 2004-05-14
Category : Science
ISBN : 9783540210498
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Author : Harry Veendrick
Publisher : Springer Nature
Page : 697 pages
File Size : 39,13 MB
Release :
Category :
ISBN : 303164249X
Author : Ban Wong
Publisher : John Wiley & Sons
Page : 413 pages
File Size : 15,38 MB
Release : 2005-04-08
Category : Technology & Engineering
ISBN : 0471678864
Based on the authors' expansive collection of notes taken over the years, Nano-CMOS Circuit and Physical Design bridges the gap between physical and circuit design and fabrication processing, manufacturability, and yield. This innovative book covers: process technology, including sub-wavelength optical lithography; impact of process scaling on circuit and physical implementation and low power with leaky transistors; and DFM, yield, and the impact of physical implementation.
