› › Vlsi Metallization

VLSI Metallization

Author : Norman G. Einspruch

Publisher : Academic Press

Page : 491 pages

File Size : 31,8 MB

Release : 2014-12-01

Category : Technology & Engineering

ISBN : 1483217817

Get eBook

Book Description

VLSI Electronics Microstructure Science, Volume 15: VLSI Metallization discusses the various issues and problems related to VLSI metallization. It details the available solutions and presents emerging trends. This volume is comprised of 10 chapters. The two introductory chapters, Chapter 1 and 2 serve as general references for the electrical and metallurgical properties of thin conducting films. Subsequent chapters review the various aspects of VLSI metallization. The order of presentation has been chosen to follow the common processing sequence. In Chapter 3, some relevant metal deposition techniques are discussed. Chapter 4 presents the methods of VLSI lithography and etching. Conducting films are first deposited at the gate definition step; therefore, the issues related to gate metallization are discussed next in Chapter 5.In Chapter 6, contact metallization is elaborated, and Chapter 7 is devoted to multilevel metallization schemes. Long-time reliability is the subject of Chapter 8, which discusses the issues of contact and interconnect electromigration. GaAs metallization is tackled in Chapter 9. The volume concludes with a general discussion of the functions of interconnect systems in VLSI. Materials scientists, processing and design engineers, and device physicists will find the book very useful.



VLSI Metallization

Author : Krishna Shenai

Publisher : Artech House Publishers

Page : 548 pages

File Size : 32,58 MB

Release : 1991

Category : Technology & Engineering

ISBN :

Get eBook

Book Description

This comprehensive collection of reprinted articles presents the most important developments on VLSI contact and interconnect technologies and applications. The book covers important developments in metallization of compound semiconductor technologies, and includes a section on metallization reliability and high speed testing.





Metal-semiconductor Interfaces

Author : Akio Hiraki

Publisher : IOS Press

Page : 422 pages

File Size : 35,4 MB

Release : 1995

Category : Technology & Engineering

ISBN : 9784274900396

Get eBook

Book Description



Multi-Net Optimization of VLSI Interconnect

Author : Konstantin Moiseev

Publisher : Springer

Page : 245 pages

File Size : 27,23 MB

Release : 2014-11-07

Category : Technology & Engineering

ISBN : 1461408210

Get eBook

Book Description

This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.



Integrated Circuit Fabrication

Author : Shubham Kumar

Publisher : CRC Press

Page : 353 pages

File Size : 17,60 MB

Release : 2021-04-28

Category : Technology & Engineering

ISBN : 1000396401

Get eBook

Book Description

This book covers theoretical and practical aspects of all major steps in the fabrication sequence. This book can be used conveniently in a semester length course on integrated circuit fabrication. This text can also serve as a reference for practicing engineer and scientist in the semiconductor industry. IC Fabrication are ever demanding of technology in rapidly growing industry growth opportunities are numerous. A recent survey shows that integrated circuit currently outnumber humans in UK, USA, India and China. The spectacular advances in the development and application of integrated circuit technology have led to the emergence of microelectronic process engineering as an independent discipline. Integrated circuit fabrication text books typically divide the fabrication sequence into a number of unit processes that are repeated to form the integrated circuit. The effect is to give the book an analysis flavor: a number of loosely related topics each with its own background material. Note: T& F does not sell or distribute the Hardback in India, Pakistan, Nepal, Bhutan, Bangladesh and Sri Lanka.



Metal – Semiconductor Contacts and Devices

Author : Simon S. Cohen

Publisher : Academic Press

Page : 435 pages

File Size : 42,57 MB

Release : 2014-12-01

Category : Technology & Engineering

ISBN : 1483217795

Get eBook

Book Description

VLSI Electronics Microstructure Science, Volume 13: Metal-Semiconductor Contacts and Devices presents the physics, technology, and applications of metal-semiconductor barriers in digital integrated circuits. The emphasis is placed on the interplay among the theory, processing, and characterization techniques in the development of practical metal-semiconductor contacts and devices. This volume contains chapters that are devoted to the discussion of the physics of metal-semiconductor interfaces and its basic phenomena; fabrication procedures; and interface characterization techniques, particularly, ohmic contacts. Contacts that involve polycrystalline silicon; applications of the metal-semiconductor barriers in MOS, bipolar, and MESFET digital integrated circuits; and methods for measuring the barrier height are covered as well. Process engineers, device physicists, circuit designers, and students of this discipline will find the book very useful.



VLSI Technology

Author : Yasuo Tarui

Publisher : Springer Science & Business Media

Page : 464 pages

File Size : 25,78 MB

Release : 2013-03-12

Category : Technology & Engineering

ISBN : 3642691927

Get eBook

Book Description

The origin of the development of integrated circuits up to VLSI is found in the invention of the transistor, which made it possible to achieve the ac tion of a vacuum tube in a semiconducting solid. The structure of the tran sistor can be constructed by a manufacturing technique such as the intro duction of a small amount of an impurity into a semiconductor and, in ad dition, most transistor characteristics can be improved by a reduction of dimensions. These are all important factors in the development. Actually, the microfabrication of the integrated circuit can be used for two purposes, namely to increase the integration density and to obtain an improved perfor mance, e. g. a high speed. When one of these two aims is pursued, the result generally satisfies both. We use the Engl ish translation "very large scale integration (VLSIl" for "Cho LSI" in Japanese. In the United States of America, however, similar technology is bei ng developed under the name "very hi gh speed integrated circuits (VHSIl". This also originated from the nature of the integrated circuit which satisfies both purposes. Fortunately, the Japanese word "Cho LSI" has a wider meani ng than VLSI, so it can be used ina broader area. However, VLSI has a larger industrial effect than VHSI.



High-Speed VLSI Interconnections

Author : Ashok K. Goel

Publisher : John Wiley & Sons

Page : 433 pages

File Size : 33,65 MB

Release : 2007-10-19

Category : Technology & Engineering

ISBN : 0470165960

Get eBook

Book Description

This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.



Integrated Circuit Quality and Reliability

Author : Eugene R. Hnatek

Publisher : CRC Press

Page : 809 pages

File Size : 30,3 MB

Release : 2018-10-03

Category : Technology & Engineering

ISBN : 1482277719

Get eBook

Book Description

Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.