VLSI-SoC: Advanced Topics on Systems on a Chip


Book Description

This book contains extended and revised versions of the best papers that were presented during the fifteenth edition of the IFIP/IEEE WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 15th conference was held at the Georgia Institute of Technology, Atlanta, USA (October 15-17, 2007). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt, Perth and Nice. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5 and by the IEEE Council on Electronic Design Automation (CEDA), is to provide a forum to exchange ideas and show industrial and academic research results in the field of microelectronics design. The current trend toward increasing chip integration and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI-SoC conferences aim to address these exciting new issues.




VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things


Book Description

This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.




Adaptable Embedded Systems


Book Description

As embedded systems become more complex, designers face a number of challenges at different levels: they need to boost performance, while keeping energy consumption as low as possible, they need to reuse existent software code, and at the same time they need to take advantage of the extra logic available in the chip, represented by multiple processors working together. This book describes several strategies to achieve such different and interrelated goals, by the use of adaptability. Coverage includes reconfigurable systems, dynamic optimization techniques such as binary translation and trace reuse, new memory architectures including homogeneous and heterogeneous multiprocessor systems, communication issues and NOCs, fault tolerance against fabrication defects and soft errors, and finally, how one can combine several of these techniques together to achieve higher levels of performance and adaptability. The discussion also includes how to employ specialized software to improve this new adaptive system, and how this new kind of software must be designed and programmed.




Towards a Design Flow for Reversible Logic


Book Description

The development of computing machines found great success in the last decades. But the ongoing miniaturization of integrated circuits will reach its limits in the near future. Shrinking transistor sizes and power dissipation are the major barriers in the development of smaller and more powerful circuits. Reversible logic p- vides an alternative that may overcome many of these problems in the future. For low-power design, reversible logic offers signi?cant advantages since zero power dissipation will only be possible if computation is reversible. Furthermore, quantum computation pro?ts from enhancements in this area, because every quantum circuit is inherently reversible and thus requires reversible descriptions. However, since reversible logic is subject to certain restrictions (e.g. fanout and feedback are not directly allowed), the design of reversible circuits signi?cantly differs from the design of traditional circuits. Nearly all steps in the design ?ow (like synthesis, veri?cation, or debugging) must be redeveloped so that they become applicable to reversible circuits as well. But research in reversible logic is still at the beginning. No continuous design ?ow exists so far. Inthisbook,contributionstoadesign?owforreversiblelogicarepresented.This includes advanced methods for synthesis, optimization, veri?cation, and debugging.




Design Automation for Field-coupled Nanotechnologies


Book Description

This book discusses the main tasks of Design Automation for Field-coupled Nanocomputing (FCN) technologies, in order to enable large-scale composition of elementary building blocks, that obtain correct systems from given function specifications. To this end, a holistic design flow is described, which covers exact and scalable placement & routing, one-pass logic synthesis, novel clocking mechanisms for data synchronization, and formal verification for obtained circuit layouts. Additionally, theoretical groundwork is presented that lays the foundation for any algorithmic consideration in the future. Furthermore, an open-source FCN design framework called fiction, which contains implementations of all proposed techniques, is presented and made publicly available. The approaches discussed in this book address obstacles that have existed since the conceptualization of the FCN paradigm and could not be resolved since then. As a result, this book substantially advances the state of the art in design automation for FCN technologies.




Design of System on a Chip


Book Description

Design of System on a Chip is the first of two volumes addressing the design challenges associated with new generations of the semiconductor technology. The various chapters are the compilations of tutorials presented at workshops in Brazil in the recent years by prominent authors from all over the world. In particular the first book deals with components and circuits. Device models have to satisfy the conditions to be computationally economical in addition to be accurate and to scale over various generations of technology. In addition the book addresses issues of the parasitic behavior of deep sub-micron components, such as parameter variations and sub-threshold effects. Furthermore various authors deal with items like mixed signal components and memories. We wind up with an exposition of the technology problems to be solved if our community wants to maintain the pace of the "International Technology Roadmap for Semiconductors" (ITRS).




System-on-Chip for Real-Time Applications


Book Description

System-on-Chip for Real-Time Applications will be of interest to engineers, both in industry and academia, working in the area of SoC VLSI design and application. It will also be useful to graduate and undergraduate students in electrical and computer engineering and computer science. A selected set of papers from the 2nd International Workshop on Real-Time Applications were used to form the basis of this book. It is organized into the following chapters: -Introduction; -Design Reuse; -Modeling; -Architecture; -Design Techniques; -Memory; -Circuits; -Low Power; -Interconnect and Technology; -MEMS. System-on-Chip for Real-Time Applications contains many signal processing applications and will be of particular interest to those working in that community.




System on Package


Book Description

System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.




A Practical Approach to VLSI System on Chip (SoC) Design


Book Description

Now in a thoroughly revised second edition, this practical practitioner guide provides a comprehensive overview of the SoC design process. It explains end-to-end system on chip (SoC) design processes and includes updated coverage of design methodology, the design environment, EDA tool flow, design decisions, choice of design intellectual property (IP) cores, sign-off procedures, and design infrastructure requirements. The second edition provides new information on SOC trends and updated design cases. Coverage also includes critical advanced guidance on the latest UPF-based low power design flow, challenges of deep submicron technologies, and 3D design fundamentals, which will prepare the readers for the challenges of working at the nanotechnology scale. A Practical Approach to VLSI System on Chip (SoC) Design: A Comprehensive Guide, Second Edition provides engineers who aspire to become VLSI designers with all the necessary information and details of EDA tools. It will be a valuable professional reference for those working on VLSI design and verification portfolios in complex SoC designs




Interconnect-Centric Design for Advanced SOC and NOC


Book Description

In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.