Index of Conference Proceedings


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Proceedings of the ASME Heat Transfer Division, 2002: Computational heat transfer


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Annotation Consists of 37 papers drawn from sessions held by the heat transfer division of the ASME during the November 2002 congress. The contributors explore high performance computing in thermal problems, numerical modeling of turbulent heat transfer, parametric estimation in thermal systems, and industrial applications. Topics include tin solidification in the presence of turbulent natural convection, an inverse algorithm to estimate spatially varying thermal contact resistance, a global heat transfer model for a silicon crystal growth system, and heat transfer correlations for a CVD optical fiber coating process. No subject index is provided. Annotation (c)2003 Book News, Inc., Portland, OR (booknews.com).




Proceedings of the ASME Heat Transfer Division--2000: Combustion synthesis, flame, and materials processes. Combustion in practical systems. Modeling and numerical simulation of combustion processes. Industrial applications of porous media methods in environmental heat transfer. Industrial applications of computational heat transfer. Numerical simulations of turbulent heat transfer. Computational developments in manufacturing and materials processing


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Proceedings of the ASME Heat Transfer Division--2000: Experimental methods in convection heat transfer. Symposium on calibration, modeling of heat flux sensors. Fundamentals of local heat flux measurements. Symposium on fundamentals of heat transfer in flames. Aerospace applications in heat transfer, Heat transfer in separated flows, Advances in electronic cooling, Thermal hydraulics of advanced nuclear reactors, Active control of heat transfer, chaos and nonlinearity, Energy systems education


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Proceedings of the ASME Heat Transfer Division, 2000: Condensation and boiling heat transfer. Heat transfer enhancement in multi-phase flow. CFD in multidimensional two-phase flow. Multi-phase flow in industrial applications. Cooling of electronic components and systems. Air cooling limits in thermal management of electronic systems. Applications of heat pipes and capillary pumped loops to electronic systems


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